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Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
It's not easy to think about packaging well:
Rx:the resistance, a lot of resistance in the circuit diagram, according to theserial number, R1, R2...
Starting from the improvement of system electromagnetic compatibility, combined with the characteristics of hybrid integrated circuit technology, the problems that should be paid attention to and the specific measures taken in the design of hybrid integrated circuits are proposed.
The application of differential signal in high-speed circuit design is more and more extensive. The most critical signal in the circuit always uses differential structure design. What other way is it so popular? How can we ensure good performance in PCB design? With these two questions, we will discuss the next section. What is a differential signal? In layman's terms, the driver sends two equal-valued, inverted signals. The receiver determines whether the logic state is "0" or "1" by comparing the difference between these two voltages. The pair of traces carrying the differential signal is called differential trace.
Radiated EMI interference can come from an undirected source and an unintentional antenna. Conductive EMI interference can also come from a source of radiated EMI interference or caused by some board components. Once your board receives conductive interference, it resides in the PCB trace of the application circuit. Some common sources of radiated EMI interference include the components discussed in previous articles, as well as on-board switching power supplies, cables and switches, or clock networks.
The core part of the PCB design method based on signal integrity computer analysis is the establishment of the PCB board level signal integrity model, which is the difference from the traditional design method. The correctness of the SI model will determine the correctness of the design, and the establishability of the SI model determines the feasibility of this design method.
The via design consists of a pad and a pad area around the hole and an inner electrically isolated area. The parasitic inductance, parasitic capacitance, etc. of the vias affect the high-speed signals passing through the vias. The size of the vias and the pads connected to them have a direct effect on the properties of the vias.
The earlier the signal integrity (SI) problem is solved, the more efficient the design is, so that the termination of the device is not added until the board design is complete. There are many tools and resources for SI design planning. This article explores the core issues of signal integrity and several methods for solving SI problems, ignoring the technical details of the design process.
1. How to choose PCB board?
In the field of network communication, in ATM switches, core routers, Gigabit Ethernet, and various gateway devices, the system data rate and clock rate continue to increase, and the operating frequency of the corresponding processor is also higher; data, voice, and image transmission.
Since the printed circuit board is not a general end product, the definition of the name is slightly confusing. For example, the motherboard for the personal computer is called the motherboard and cannot be directly called the circuit board. Although there is a circuit board in the motherboard, It's not the same, so when you evaluate the industry, you can't say the same thing. For example, because there are integrated circuit parts on the board, the news media called him an IC board, but in fact he is not equivalent to a printed circuit board.
Can you introduce some foreign technical books and materials on high-speed PCB design?
To do a good design, as the designer's first thing to do is to have a general overall layout, in order to make a specific design. The same pcb design is also the case, want to make the pcb board to achieve what they want, the overall layout, the placement of components is the primary consideration, they play a key role in the design of pcb board, they directly affect the entire printed circuit Board installation, reliability, ventilation, heat dissipation, wiring through rate.
The schematic design software will be available in ORCAD. The supported Netlist is much more than the industry standard.
Multi-layer and double-sided PCB design is similar, and even easier.
In this article, we will teach you how to do a PCB design easily 25-30
In the low-power RF PCB design, the standard FR4 material is used (good insulation properties, uniform material, dielectric constant ε = 4, 10%).
The following is an introduction to the testing experience and methods of resistors.
There are two main roles.
MOEMS packaging requirements are: resistance to mechanical and thermal shock, vibration and chemical resistance, and long life. Including wafer and wafer adhesion thickness, wafer cutting, die attach chip mounting process, thermal control, stress isolation, hermetic packaging, inspection and adjustment.
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