PCB Manufacturer & PCB Assembly | Advanced Circuits

PROTEL99 electrical coating addition, deletion and segmentation skills

Posted on April 11, 2019 by G

The PROTEL99 electrical layer is divided into two types, the positive layer and the negative layer. These two layers have completely different properties and usage methods.

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PCB process skills based on GENESIS2000 software (3)

Posted on April 04, 2019 by G

7. Solder mask 8. BGA plug hole 9. Network comparison 10. Character layer

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PCB process skills based on GENESIS2000 software (2)

Posted on April 04, 2019 by G

4. Drilling Editing 5. Drilling Outline Drawing 6. Circuit Layer

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PCB process skills based on GENESIS2000 software (1)

Posted on April 04, 2019 by G

1. Shape 2. Orig 3. Matrix

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Introduction to EDA software commonly used in circuit design

Posted on April 02, 2019 by G

The below describes several EDA software commonly used in circuit design. There are many EDA softwares in this industry, such as transformer design, electrical design, integrated circuit design, etc., as well as various microcontrollers. Simulation software.

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How to deal with moisture sensitive components in PCB design

Posted on April 02, 2019 by G

How to deal with moisture sensitive components in PCB design involves the moisture sensitivity of plastic integrated circuits (ICs), which is getting worse and worse, due to many industrial trends, including the use of support for critical communications and The constant search for higher reliability products for technical applications. The failure rate of a moisture-sensitive device (MSD) alone is already at an unacceptable level, coupled with the ever-changing packaging technology. Shorter development cycles, shrinking sizes, new materials and larger chips are causing a rapid increase in the number of MSDs and a higher level of moisture/reflow sensitivity. Finally, the growth in the use of area-arranged packages such as BGA and CSP has also had a major impact. This is because these components tend to be packaged in tape-and-reel systems, each having a large number of components. When compared to the pin components in the IC tray, the key issue is that the exposure to moisture is longer.

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9 standards for RF in PCB design

Posted on April 02, 2019 by G

In the low-power RF PCB design, the standard FR4 material is used (good insulation properties, uniform material, dielectric constant ε = 4, 10%).

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Tag: PCB design pcb design mixed-signal pcb RF circuit

POWERPCB tips

Posted on March 29, 2019 by G

PowerPCB enables users to achieve high-quality design and vividly reflects all aspects of the electronics design industry. Its constraint-driven design approach reduces product completion time. You can define safety spacing, routing rules, and design rules for high-speed circuits for each signal, and apply these plans hierarchically to the board, to each layer, to each type of network, to each network, to each group. On the network, each pin is placed to ensure the correctness of the layout design. It includes a wide range of features including clustering tools, dynamic routing editing, dynamic electrical performance checks, automatic dimensioning and powerful CAM output capabilities. It also has the ability to integrate third-party software tools such as the SPECCTRA router.

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PCB layout principle

Posted on March 29, 2019 by G

The anti-jamming measures that are not common in some literatures are detailed below. Considering the practical application, especially in the trial production of products, double panels are still widely used. The following contents are mainly for double panels.

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Summary of high quality PCB design experience - component layout

Posted on March 29, 2019 by G

Reasonable layout of components is the basic premise for designing high quality PCB drawings. The requirements for component layout mainly include installation, stress, heat, signal and aesthetic requirements.

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Technical insights into the design of PCB design in the 3D world

Posted on March 29, 2019 by G

PCB design tools have grown steadily in recent years to address the challenges of this increasingly complex design landscape. A major change – the adoption of 3D capabilities, is expected to allow designers to balance design innovation with the competitiveness of the global marketplace.

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Inductor and transformer testing methods and experience

Posted on March 29, 2019 by G

The following is an introduction to the testing experience and methods of inductors and transformers.

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Capacitor detection method and experience

Posted on March 29, 2019 by G

The following is an introduction to the testing experience and methods of capacitors.

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Resistor detection method and experience

Posted on March 29, 2019 by G

The following is an introduction to the testing experience and methods of resistors.

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Power line and ground wire processing technology in PCB

Posted on March 28, 2019 by G

In the PCB layout, the handling of the power and ground wires is very important. The noise interference generated by the power cables and ground wires should be minimized to ensure the quality of the products.

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PCB layout three special routing skills

Posted on March 28, 2019 by G

1. Right angle routing (three aspects) 2. Differential traces ("equal length, equidistant, reference plane") 3. Serpentine line (adjustment delay)

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Summary of Multilayer Board (BUM-PCB)

Posted on March 20, 2019 by G

As early as the 1970s, there was already a literature report on BUM technology, but it was not until the early 1990s that the Japanese company (Yasu) developed a coating of photosensitive resin on the core board to form conductive micropores by photo-induced method. Even after the new method of manufacturing a high-density circuit board by the new method of addition, the high-density circuit board was successfully used in a Thinkpad type notebook computer, and the new technology was first published in 1991. It is called Surface Laminar Circuit, SLC (Surface Laminated Circuit Board). Since this technology has created an unprecedented high-density Interconnect, HDI (High-density Interconnect) new ideas, Japanese electronics manufacturers have developed and unveiled The BUM era in the history of PCB development.

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Introduction of high-density HDI circuit boards and circuit boards

Posted on March 20, 2019 by G

Since the printed circuit board is not a general end product, the definition of the name is slightly confusing. For example, the motherboard for the personal computer is called the motherboard and cannot be directly called the circuit board. Although there is a circuit board in the motherboard, It's not the same, so when you evaluate the industry, you can't say the same thing. For example, because there are integrated circuit parts on the board, the news media called him an IC board, but in fact he is not equivalent to a printed circuit board.

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The role and location of characteristic impedance in signal integrity

Posted on March 13, 2019 by G

When the signal propagates on the transmission line, the transient impedance sensed by the signal is related to the capacitance per unit length and the dielectric constant of the material.

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Fast Positioning of Signal Integrity Problems in High Speed Circuit Design

Posted on March 13, 2019 by G

In high-speed circuit design, the traditional approach to locating signal integrity problems is to use hardware triggers to isolate events and/or to capture events using deep acquisition storage techniques before looking for problems. As the speed and complexity of high-performance circuit systems continue to increase, the limitations of using oscilloscopes to locate signal integrity problems are becoming more prominent.

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PROTEL99 electrical coating addition, deletion and segmentation skills

PCB process skills based on GENESIS2000 software (3)

PCB process skills based on GENESIS2000 software (2)

PCB process skills based on GENESIS2000 software (1)

Introduction to EDA software commonly used in circuit design

How to deal with moisture sensitive components in PCB design

9 standards for RF in PCB design

POWERPCB tips

PCB layout principle

Summary of high quality PCB design experience - component layout

Technical insights into the design of PCB design in the 3D world

Inductor and transformer testing methods and experience

Capacitor detection method and experience

Resistor detection method and experience

Power line and ground wire processing technology in PCB

PCB layout three special routing skills

Summary of Multilayer Board (BUM-PCB)

Introduction of high-density HDI circuit boards and circuit boards

The role and location of characteristic impedance in signal integrity

Fast Positioning of Signal Integrity Problems in High Speed Circuit Design

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Recommended Article:

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PROTEL99 electrical coating addition, deletion and segmentation skills

PCB process skills based on GENESIS2000 software (3)

PCB process skills based on GENESIS2000 software (2)

PCB process skills based on GENESIS2000 software (1)

Introduction to EDA software commonly used in circuit design

How to deal with moisture sensitive components in PCB design

9 standards for RF in PCB design

POWERPCB tips

PCB layout principle

Summary of high quality PCB design experience - component layout

Technical insights into the design of PCB design in the 3D world

Inductor and transformer testing methods and experience

Capacitor detection method and experience

Resistor detection method and experience

Power line and ground wire processing technology in PCB

PCB layout three special routing skills

Summary of Multilayer Board (BUM-PCB)

Introduction of high-density HDI circuit boards and circuit boards

The role and location of characteristic impedance in signal integrity

Fast Positioning of Signal Integrity Problems in High Speed ​​Circuit Design

Categories

Recommended Article:

Fast Positioning of Signal Integrity Problems in High Speed Circuit Design