Latest News & Update for PCB Manufacturing & Assembly

The Top 20 PCB Manufacturers in The World

Posted on November 20, 2024 by NextPCB

Top PCB manufacturers in the world include 1. NextPCB 2. ZDT 3. Compeq Manufacturing 4. Shengyi Technology 5. Advanced Circuit International

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Tag: pcb manufacturer PCB Manufacturer PCB manufacturer

Build Long-Range IoT Networks with Free RFM69HCW Prototypes-NextPCB Accelerator #12

Posted on July 09, 2025 by viviane

NextPCB's latest Accelerator campaign offers free RFM69HCW-based prototypes to support innovative IoT and wireless projects. The RFM69HCW transceiver provides long-range, low-power communication with AES encryption, ideal for smart agriculture, automation, and mesh networks. Participants get 2 free PCBAs, technical support, and discounted bulk production. Submit your original design to join!

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Tag: wireless networks IoT RFM69HCW hoperf

RP2040 + Cyclone 10 FPGA PCB Design Project

Posted on July 03, 2025 by vivian

This article introduces the RP2040 and Cyclone 10 FPGA hybrid PCB development board project designed by Khaled Magdy. The project is designed with Kicad and supported by NextPCB Accelerator to provide embedded system developers and FPGA enthusiasts with a powerful experimental platform for exploring high-speed communication, hardware acceleration, and custom peripheral expansion. The board has a dual-chip architecture, high-speed SPI and custom PIO communication interfaces, and rich on-board peripherals.

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Tag: KiCad FPGA NextPCB Accelerator RP2040

KiCad 9: Design & assemble an ESP32 IoT 4-layer PCB

Posted on July 03, 2025 by vivian

This project showcases the design and assembly of a 4-layer ESP32 IoT PCB using KiCad 9. Packed with sensors and connectivity, this board is engineered for edge-based AI inference, classification, and decision-making, making it ideal for smart home, environmental analysis, and predictive maintenance applications. The article highlights how KiCad 9's new features streamline the PCB development process, offering a smoother and more intuitive design experience.

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Tag: esp32 IoT Kicad KiCad9

How to Design Mechanical Keyboard PCBs with Kicad

Posted on July 03, 2025 by vivian

Want to design your own custom mechanical keyboard? This guide dives into Joe Scotto's excellent tutorial on creating a 3x3 macro pad using KiCad. Learn about keyboard matrix wiring, PCB layout, microcontroller integration, and more. Get ready to turn your keyboard dreams into reality with detailed steps and a dedicated KiCad library to kickstart your project!

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Tag: KiCad Keyboard PCB pcblayout

Exploring the CM5 MINIMA REV3: A Compact Powerhouse for Embedded Projects

Posted on July 03, 2025 by vivian

let's dive into an exciting new project with NextPCB—the CM5 MINIMA REV3, a compact yet powerful carrier board designed for the Raspberry Pi Compute Module 5 (CM5).

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Tag: KiCad IoT Raspberry Pi

Quick Turn PCB Manufacturer: Your Reliable Partner for Urgent Projects -NextPCB

Posted on June 25, 2025 by Robin

Choose a professional quick-turn PCB manufacturer is crucial. This article will delve into the core advantages such PCB manufacturers offer in terms of speed and efficiency, rapid response and on-time delivery, reliable quality and extensive experience, and powerful technical support, revealing how they can help you accelerate product launch and confidently navigate market challenges.

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Best 6-Layer PCB Stackups for Signal Integrity & Impedance Control

Posted on June 18, 2025 by Ivy

Struggling with PCB signal integrity? Discover the proven 6-layer stackup configuration for precise 50Ω single-ended and 90Ω differential impedance control. Learn dual ground plane strategy, optimal layer arrangement, and recommended trace widths for 1.6mm / 1oz boards. Maximize EMI performance & minimize warpage

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SMT Red Glue: Why It’s Used & How to Optimize for Cost-Effective PCB Assembly

Posted on June 18, 2025 by Ivy

Learn why SMT red glue is used (double-sided reflow, vibration, flatness issues) and its hidden costs (process, production, timeline). HQ NextPCB experts share practical tips to avoid red glue by optimizing PCB design & component selection. Boost SMT efficiency & reduce PCBA cost!”

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How to Select the Optimal PCB Hole Size for Through-Hole Pins (Avoid Assembly Failures!)

Posted on June 18, 2025 by Ivy

Why it worked last batch, why it faied this time? You need to know this before you release your design for mass production.

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NextPCB Lands on Crowd Supply: Supercharging Hardware Startups from Prototype to Production

Posted on June 05, 2025 by viviane

NextPCB joins forces with Crowd Supply to launch the NextPCB Launchpad—offering free prototyping, global shipping, full manufacturing support, and personalized guidance to help hardware startups go from prototype to production

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How HDI Impacts PCB Lead Time?

Posted on June 06, 2025 by NextPCB

Concerned about the lead time for your High-Density Interconnect (HDI) PCBs? Ever wondered why your 14-layer, 3-stack HDI board might take 30 working days to deliver?While factors like layer count, impedance, and stack-up generally impact PCB lead times, HDI's unique complexity plays a crucial role. This article dives deep into how HDI processes affect PCB lead time, exploring specific production steps that extend schedules and how different HDI structures (e.g., 1-stack, 2-stack, 3-stack) directly influence delivery. We'll also provide practical tips on optimizing HDI structures to effectively shorten your lead time, helping you better estimate and manage project timelines in PCB design and procurement.

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Build Low-Cost Bluetooth BLE 5.1 Devices with HLK-B40 and Free PCBA Prototypes - NextPCB Accelerator #10

Posted on June 12, 2025 by Carmen Zheng

Through the NextPCB Accelerator program, engineers can now get free access to the HLK-B40 BLE 5.1 module prototype PCBA provided by Hi-Link. The HLK-B40 is a high-performance, ultra-low-cost Bluetooth module suitable for applications such as IoT, smart home, wearable devices, etc. This article will introduce its key features, application scenarios, and how to quickly start your product development with the support of NextPCB

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What the IoT Startups should know When Selecting IoT Hardware Partners

Posted on May 14, 2025 by ivy

Explores how startups can evaluate hardware service models, understand pricing, collaborate effectively with design and manufacturing partners, and avoid common pitfalls in the IoT hardware development process.

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Tag: IoT

Unveiling the Characteristics and Implementation of Flip Chip Bonding Technology

Posted on April 27, 2025 by Edison

This article delves into the features, implementation process, and detailed techniques of Flip Chip Bonding (FCB) technology, a cornerstone in advanced PCB assembly and semiconductor packaging.

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Comprehensive Comparison of PCB Additive and Subtractive Methods

Posted on March 27, 2025 by NextPCB

Comprehensive Comparison of PCB Additive and Subtractive Methods: In-Depth Analysis of Processes, Costs, and Application Scenarios

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Understanding the Differences Between CPU, MCU, MPU, SoC, DSP, ECU, GPU, and FPGA

Posted on March 20, 2025 by NextPCB

Comprehensive introduction to various types of chips in terms of function and structure.

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RAK3172: The Ultimate LoRaWAN Module for IoT Applications in 2025

Posted on March 14, 2025 by NextPCB

Explain the powerful functions and main application areas of the rak3172 with practical examples.

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Unlocking FPGA Innovation with Tang Nano 20K: Features, Advantages, and Applications

Posted on March 10, 2025 by NextPCB

Comprehensive introduction of Tang Nano 20K application and how nextpcb provides pcb assembly prototyping service.

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Enhancing IoT Connectivity with SIM7600 Series

Posted on March 28, 2025 by NextPCB

Combined with the application scenarios, detailed introduction of sim7600 series chip product parameters and advantages

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The Top 20 PCB Manufacturers in The World

Build Long-Range IoT Networks with Free RFM69HCW Prototypes-NextPCB Accelerator #12

RP2040 + Cyclone 10 FPGA PCB Design Project

KiCad 9: Design & assemble an ESP32 IoT 4-layer PCB

How to Design Mechanical Keyboard PCBs with Kicad

Exploring the CM5 MINIMA REV3: A Compact Powerhouse for Embedded Projects

Quick Turn PCB Manufacturer: Your Reliable Partner for Urgent Projects -NextPCB

Best 6-Layer PCB Stackups for Signal Integrity & Impedance Control

SMT Red Glue: Why It’s Used & How to Optimize for Cost-Effective PCB Assembly

How to Select the Optimal PCB Hole Size for Through-Hole Pins (Avoid Assembly Failures!)

NextPCB Lands on Crowd Supply: Supercharging Hardware Startups from Prototype to Production

How HDI Impacts PCB Lead Time?

Build Low-Cost Bluetooth BLE 5.1 Devices with HLK-B40 and Free PCBA Prototypes - NextPCB Accelerator #10

What the IoT Startups should know When Selecting IoT Hardware Partners

Unveiling the Characteristics and Implementation of Flip Chip Bonding Technology

Comprehensive Comparison of PCB Additive and Subtractive Methods

Understanding the Differences Between CPU, MCU, MPU, SoC, DSP, ECU, GPU, and FPGA

RAK3172: The Ultimate LoRaWAN Module for IoT Applications in 2025

Unlocking FPGA Innovation with Tang Nano 20K: Features, Advantages, and Applications

Enhancing IoT Connectivity with SIM7600 Series

Categories

Recommended Article:

BLOG

The Top 20 PCB Manufacturers in The World

Build Long-Range IoT Networks with Free RFM69HCW Prototypes-NextPCB Accelerator #12

RP2040 + Cyclone 10 FPGA PCB Design Project

KiCad 9: Design & assemble an ESP32 IoT 4-layer PCB

How to Design Mechanical Keyboard PCBs with Kicad

Exploring the CM5 MINIMA REV3: A Compact Powerhouse for Embedded Projects

Quick Turn PCB Manufacturer: Your Reliable Partner for Urgent Projects -NextPCB

Best 6-Layer PCB Stackups for Signal Integrity & Impedance Control

SMT Red Glue: Why It’s Used & How to Optimize for Cost-Effective PCB Assembly

How to Select the Optimal PCB Hole Size for Through-Hole Pins (Avoid Assembly Failures!)

NextPCB Lands on Crowd Supply: Supercharging Hardware Startups from Prototype to Production

How HDI Impacts PCB Lead Time?

Build Low-Cost Bluetooth BLE 5.1 Devices with HLK-B40 and Free PCBA Prototypes - NextPCB Accelerator #10

What the IoT Startups should know When Selecting IoT Hardware Partners

Unveiling the Characteristics and Implementation of Flip Chip Bonding Technology

Comprehensive Comparison of PCB Additive and Subtractive Methods

Understanding the Differences Between CPU, MCU, MPU, SoC, DSP, ECU, GPU, and FPGA

RAK3172: The Ultimate LoRaWAN Module for IoT Applications in 2025

Unlocking FPGA Innovation with Tang Nano 20K: Features, Advantages, and Applications

Enhancing IoT Connectivity with SIM7600 Series

Categories

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