PCB Capabilities

PCB Specifications

Items	Manufacturing Capabilities	Notes	Patterns
Layer count	1 - 32 layers	Quantity of copper layers on the board	/
Impedance	For 4, 6, 8, 10, 12, 14, 16, 18, 20 layers PCB, PCB Stackup designed by NextPCB(by default), or PCB Stackup designed by customers	Layer Stackup Structure Impedance Calculation Parameter	/
Impedance tolerance	±10%	/	/
Material	FR-4	FR-4: TG130/TG150/TG170
PCB material dielectric constant	4.2	Prepreg dielectric constant (prepregtype: 7628/1080/2313/2116, dielectric constant: 4.2)	/
Max. dimension	1-2 layers: 500600mm 4-20 layers: 400500mm	The maximum dimension that NextPCB can do
Min. dimension	Length and width ≥10mm	Min. dimension = 10*10mm	/
Dimension tolerance	CNC: ±0.15mm, V-CUT: ±0.2mm	±0.15mm for CNC routing, and ±0.2mm for V-scoring	/
PCB thickness	0.6/0.8/1.0/1.2/1.6/2.0/2.5/3.0/3.2mm	The thickness of finished board
Thickness tolerance ( Thickness≥1.0mm)	±10%	e.g. If the board thickness is 1.6mm, the finished board thickness ranges from 1.44mm(1.6-1.6×10%) to 1.76mm(1.6+1.6×10%)	/
Thickness tolerance ( Thickness < 1.0mm)	±0.1mm	e.g. If the board thickness is 0.8mm, the finished board thickness ranges from 0.7mm(0.8-0.1) to 0.9mm(0.8+0.1)	/
Finished copper weight	1 oz/2 oz	Finished copper weight of outer layer could be 1 oz/2 oz
Inner copper weight	0.5 oz/1 oz/2 oz	Finished copper weight of inner layer could be 0.5 oz/1 oz/2 oz
Surface finish	HASL/Lead free HASL/ENIG/OSP	/	/
HDI structure	Rank 1 /Rank 2 /Rank 3	Mechanical blind buried vias or laser blind buried vias(electroplating Via-filling is available) or laser blind vias filling dimple ≤ 15µm	/
Electrical test	Flying Probe/Special test fixture	No limits for Flying Probe. Max. 14000 Pads can be tested by PCB test fixture	/
Beveling angle of gold finger	20°/30°/45°/60°	/	/
Beveling angle tolerance of gold finger	±5°	/	/
Beveling depth tolerance of gold finger	±0.1mm	/	/
Outline tolerance	±0.15mm	/	/
V-CUT angle	30°/45°/60°	/	/
Number of V-CUT	≤30 cuts	/	/
V-CUT outline size	55mm ≤ length/width ≤ 480mm	/	/
V-CUT residue thickness	0.25mm ≤ v-cut residue thickness ≤ 0.4mm	/	/

Drill/Hole Size

Items	Manufacturing Capabilities	Notes	Patterns
Drill hole size(Mechanical)	0.15-6.5mm	Min. drill hole size: 0.15mm(available for PCB thickness ≤ 1.2mm) Max. diameter of drilling bits is 6.5mm(contact support@nextpcb.com if your customed hole size > 6.5mm)
Drill hole size tolerance	≤0.05mm	/	/
Blind/Buried vias	Mechanical blind buried vias: copper thickness of blind vias ≥ 20µm	/
Blind/Buried vias	Laser blind buried vias: dimple ≤ 10µm	/
Via pad size	≥0.1	The pad hole size will be enlarged 0.125mm in production
PTH hole size	0.2mm (for single side)	The annular ring size will be enlarged to 0.2mm in production
Min. non-plated holes	0.4mm	/
Min. plated slots	0.5mm	/
Min. non-plated slots	0.5mm	/
Min. castellated holes	0.5mm	The minimum diameter of castellated holes is 0.50mm
Hole size tolerance(Plated)	±0.075mm	e.g. If customed Plated hole size is 1.000mm, the finished hole size could be between 0.925mm to 1.075mm
Hole size Tolerance(Non-Plated)	±0.05mm	e.g. If customed Non-Plated hole size is 1.000mm, the finished hole size could be between 0.95mm to 1.05mm
Rectangle hole/Slot	With or without fillet angle	/

Minimum Annular Ring

Items	Manufacturing Capabilities	Notes	Patterns
1 oz Copper	3.5mil (single side) (3.5mil≈0.09mm)	/
2 oz Copper	4.5mil (single side) (4.5mil≈0.11mm)	/

Minimum Clearance

Items	Manufacturing Capabilities	Patterns
Hole to hole clearance(Different nets)	≥12mil(Avoid conductive anodic filament)(12mil≈0.30mm)
Via to via clearance(Same nets)	≥8mil (8mil≈0.20mm)
SMD pad to SMD pad clearance(Pad without hole, different nets)	≥0.15mm
Pad to pad clearance(Pad with hole, different nets)	≥0.40mm
Via to track	≥7mil (7mil≈0.18mm)
PTH to track	≥9mil (9mil≈0.23mm)
NPTH to track	≥8mil (8mil≈0.20mm)
SMD pad to track	≥4mil (4mil≈0.10mm)

Minimum Trace Width and Spacing

Copper weight	Min. trace width	Min. spacing
H/HOZ(0.5oz Inner layer)	2.5mil (2.5mil≈0.06mm)	3mil (3mil≈0.08mm)
1 oz(Outer layer)	3mil (3mil≈0.08mm)	3mil (3mil≈0.08mm)
2 oz(Outer layer)	5.5mil (5.5mil≈0.14mm)	5.5mil (5.5mil≈0.14mm)

BGA

Layer count	Min. BGA pad dimensions	Min. distance between BGA	Min. spacing between the center of two BGAs	Patterns
1 oz	≥0.2mm	0.15mm	0.45mm

Solder Mask

Items	Manufacturing Capabilities	Notes	Patterns
Solder mask opening/expansion	≥1.5mil (1.5mil≈0.04mm)	There should be a minimum size of 1.5mil "solder mask opening" around the pad to allow for any misregistration
Solder bridge	Green: 3.5mil Black/White: 5mil other solder mask: 4mil	To build solder bridge, the spacing between copper pads edge must be 3.5mils or more
Solder mask color	Green/Red/Yellow/Blue/White/ Matte Black/Black	/	/
Solder mask dielectric constant	3.5	/	/
Solder mask thickness	Solder mask thickness on base material: 0.8mil, solder mask thickness on copper: 0.6mil	/	/

Legend

Items	Manufacturing Capabilities	Notes	Patterns
Minimum line width	Silkscreen printing≥5mil (5mil≈0.12mm) Printer printing≥3mil (3mil≈0.08mm)	Characters width < 3mil(0.076mm) will be unidentifiable
Minimum text height	Silkscreen printing≥30mil (30mil≈0.76mm) Printer printing≥24mil (24mil≈0.61mm)	Characters height < 24mil(0.61mm) will be unidentifiable
Character width to height ratio	≥ 6:1	The preferred ratio of width to height is 6:1	/
Pad to silkscreen	>6mil (6mil≈0.15mm)	The minimum distance between pad and silkscreen is 0.15mm

Board Outlines

Items	Manufacturing Capabilities	Notes	Patterns
Trace to outline	≥0.2mm	Individual board(Rounting): Trace to Outline ≥ 0.2mm
Trace to V-cut line	≥0.4mm	Panel board with V-scoring: Trace to V-cut line ≥0.4mm

Panelization

Items	Manufacturing Capabilities	Notes
Panelization without space	0mm	No space between panelized PCBs
Panelization with space	≥1.6mm	The space between panelized PCBs should ≥ 1.6mm, if not, the routing process may be difficult and low efficiency
Panelized round board	≥80mmx80mm	Stamp Hole: hole size=0.5mm, copper gap=0.35mm, 5-7holes for a set by default
Panelized castellated holes board	Panelize with stamp holes and add tooling strips on four board edges	The distance between castellated hole and board corner should be > 4mm Recommended diameter of stamp hole is 0.5mm-0.8mm Recommended distance between the two stamp holes is 0.2mm-0.3mm
Min. width of breakaway tab	≥4mm	The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm
Min. edge rails	≥3mm	If you choose panel by NextPCB, we will add 3mm edge rails on both sides by default

Manufacturable Notes for Different PCB Design Softwares

Items	Manufacturing Capabilities	Notes	Patterns
PADS	copper-pour pattern	NextPCB Fab uses hatch pattern by default, please note your copper-pour pattern when placing an order
PADS	2D line	Valid lines cannot be placed in the corresponding layer as 2D lines, NextPCB does not process 2D lines	/
Altium Designer Protel	Version	There are elements missing issues in generating Gerber files from different versions of Altium Designer. Please note your version No. of Altium Designer when placing an order	/
	Parts outside PCB	If the components were placed far away from the PCB board, file generating would failed because the boundary of the board is too large	/
	solder mask opening	Please do not put the opening of the solder layer on the paste layer by mistake, NextPCB does nothing to the paste layer
	copper-pour pattern	Fill pattern: too much filling region will causing region missing when generating a file, Tip: choosing Polygon copper-pour pattern	/