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Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
After the following procedures, the finishing work shall be undertaken by the operator responsible for PCB board testing and repair, unless otherwise arranged. The final installer shall be responsible for reviewing and correcting the reinstallation.
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As integrated circuit output switching speeds increase and PCB board density increases, signal integrity has become one of the issues that must be addressed in high-speed digital PCB design. Factors such as components and PCB boards, layout of components on the PCB, and wiring of high-speed signals can cause signal integrity problems, resulting in unstable system operation or even no work at all.
In high speed designs, the characteristic impedance of the controllable impedance plates and lines is one of the most important and common problems. First, let's look at the definition of a transmission line: a transmission line consists of two conductors of a certain length, one for transmitting signals and the other for receiving signals (remember that the "loop" replaces the concept of "ground"). In a multi-layer board, each line is part of a transmission line, and an adjacent reference plane can be used as a second line or loop. The key to a line becoming a "good performance" transmission line is to keep its characteristic impedance constant throughout the line.
Common PCB circuit diagrams include four major types: schematics, block diagrams, assembly drawings, and printed board drawings.
In design, layout is an important part. The quality of the layout results will directly affect the effect of the wiring, so it can be considered that a reasonable layout is the first step in the success of PCB design.
The components should be arranged in a straight line in the order of the electrical schematics, and the compactness is required to shorten the length of the printed conductors and achieve a uniform assembly density. Under the premise of ensuring electrical performance requirements, the components shall be parallel or perpendicular to the board surface and parallel or perpendicular to the main board edge. It is evenly distributed on the board surface.
During the assessment, designers must ask themselves: What scale is crucial to them? Force them to review their existing development tool capabilities and begin ordering some new features.
As the packing density increases and the operating frequency increases, the signal integrity problem in MCM circuit design cannot be ignored. Taking the detector circuit as an example, this paper firstly uses APD software to realize the layout and layout design of the circuit, and then combines the signal integrity analysis to adjust the circuit layout and wiring structure repeatedly. The final Spectra Quest software simulation results show that the improved circuit layout and routing Meet signal integrity requirements while maintaining high simulation accuracy.
High-speed circuit design is a very complex design process. There are several factors that need to be considered when designing a high speed circuit. These factors are sometimes opposite each other. Such as the high-speed device layout when the position is close, although the delay can be reduced, but crosstalk and significant thermal effects may occur. Therefore, in the design, we must weigh the various factors and make a comprehensive compromise; not only meet the design requirements, but also reduce the design complexity. The adoption of high-speed PCB design means the controllability of the design process. Only controllable is reliable.
Many signal integrity problems are caused by short signal rise time. This article talks about a basic concept: the relationship between signal rise time and signal bandwidth.
Signal Integrity is a state in which the signal is not damaged. It shows that the signal maintains its correct functional characteristics after transmission through the signal line. The signal can respond with correct timing and voltage in the circuit. It can be known from the timing of the IC if the signal is in steady state time (in order to correctly identify and process the data, The IC requires a large transition within the time period during which the input data remains unchanged before and after the clock edge, and the IC may misjudge or lose part of the data. If the signal has good signal integrity, the circuit has the correct timing relationship and signal amplitude, and the data will not be captured by mistake, which means that the receiver can obtain relatively pure data. Conversely, if a signal integrity fault such as false triggering, damped oscillation, overshoot, undershoot occurs, any signal transition will occur, causing the input distortion data to be sent into the latch or captured on the distorted clock edge. Data, the signal can not respond properly, resulting in abnormal system operation and performance degradation.
This article focuses on signal integrity challenges involving high-speed interface design (the main features of RapidIO switching support these high-speed interface designs), and the ability to optimize RapidIO switching is designed to achieve high signal integrity in high-speed designs.
Reasonable layout of components is the basic premise for designing high quality PCB drawings. The requirements for component layout mainly include installation, stress, heat, signal and aesthetic requirements.
This article analyzes the causes of various interference through several typical examples. It also introduces some special rules in the design of PCB and the requirements of anti-jamming design.
To popularize LED lamps, it is necessary not only to significantly reduce costs but also to solve technical problems. How to solve the problems of energy efficiency and reliability, Doug Bailey, vice president of marketing for Power Integrations, shared the experience of efficient and reliable LED driver design.
With the increase of package density and the increase of operating frequency, the signal integrity problem in MCM circuit design can not be ignored. Taking the detector circuit as an example, this paper firstly uses APD software to realize the layout and layout design of the circuit, and then combines the signal integrity analysis to adjust the circuit layout and wiring structure repeatedly. The final Spectra Quest software simulation results show that the improved circuit layout and routing Meet signal integrity requirements while maintaining high simulation accuracy.
10 techniques
IBIS is the abbreviation of I/OBufferInformationSpecification. It is a fast and accurate method for I/OBUFFER based on I/V curve. It is an international standard that reflects the electrical characteristics of chip driver and receiver. It provides a standard file. The format is used to record parameters such as drive source output impedance, rise/fall time, and input load. It is ideal for calculation and simulation in high-speed circuit design such as oscillation and crosstalk.
When PCB layout is performed, it often happens that when a trace passes through an area, due to the limited wiring space of the area, thinner lines have to be used, and after passing through this area, the line is restored to its original width. A change in the width of the trace causes a change in impedance, so reflection occurs and affects the signal. So under what circumstances can this effect be ignored, and under what circumstances must we consider its impact?
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