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PCB board design experience sharing

As an electronic engineer, designing a circuit is a must-have hard work, and the principle design is perfect. If the board design is unreasonable, the performance will be greatly reduced, and even if it is serious, it will not work properly.

How can components be mounted on a PCB?

Now that we know that PCBs can provide mechanical support and electrical connections for electronic components, how are these electronic components mounted on the PCB?

Basic Knowledge of PCB Prototyping

In this case, we need to make holes in the board so that the pins can pass through the board to the other side, so the parts are soldered to the other side. Because of this, the front and back sides of the PCB are called the Component Side and the Solder Side.

PCB Circuit Board Testing, Inspection and Specification (3)

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PCB Circuit Board Testing, Inspection and Specification (2)

This article provides an in-depth exploration of key terms and techniques in PCB circuit board testing and inspection, covering everything from basic quality control methods to advanced testing technologies. It begins by explaining acceptability and acceptance standards, followed by the application of Acceptable Quality Level (AQL). The article then discusses common defects in PCB manufacturing, such as air inclusion bubbles, blistering, and copper foil warping, and highlights how Automatic Optical Inspection (AOI) and Automatic Testing Equipment (ATE) ensure PCB quality and reliability. Additionally, various quality tests, such as cross-cut tests, continuity tests, and solderability tests, are covered, offering strategies for ensuring that PCBs meet industry standards. By exploring these testing methods and techniques, the article helps PCB manufacturers and quality control professionals improve production efficiency and maintain high product quality.

PCB Circuit Board Testing, Inspection and Specification (1)

This article provides an in-depth exploration of key terms and techniques in PCB circuit board testing and inspection, covering everything from basic quality control methods to advanced testing technologies. It begins by explaining acceptability and acceptance standards, followed by the application of Acceptable Quality Level (AQL). The article then discusses common defects in PCB manufacturing, such as air inclusion bubbles, blistering, and copper foil warping, and highlights how Automatic Optical Inspection (AOI) and Automatic Testing Equipment (ATE) ensure PCB quality and reliability. Additionally, various quality tests, such as cross-cut tests, continuity tests, and solderability tests, are covered, offering strategies for ensuring that PCBs meet industry standards. By exploring these testing methods and techniques, the article helps PCB manufacturers and quality control professionals improve production efficiency and maintain high product quality.

Why do PCBs have to be multi-layered

For the most basic PCB, the components are concentrated on one side, and the wires are concentrated on the other side. Because only one side can be wired, we call this PCB a single panel. Both sides of the double panel can be routed, so the wiring area is twice as large as that of a single panel, making it suitable for use on more complex circuits.

Advantages and Disadvantages of Different Surface Treatments of PCB

There are many types of surface treatment of circuit boards, which should be selected according to performance and requirements. The following are simple analysis of the advantages and disadvantages of various surface treatments of PCB.

Payment Matters

Impedance PCB Production Course

Impedance PCB final test eligibility criteria

Flexible PCB Electrical Test

Downstream operators usually require PCB manufacturers to do 100% electrical testing, so they will agree with PCB manufacturers on test conditions and test methods. Therefore, both parties will clearly define the following:

PCB Test Strategies

As automated test equipment becomes part of the overall electronics assembly process, DFT must include not only traditional hardware usage issues, but also knowledge of test equipment diagnostic capabilities.

PCB Test Equipment Availability

The DFT team should be aware of the existing testing strategy. As OEMs turn to relying on more and more CMs, the equipment used varies from plant to plant. Without a clear understanding of the manufacturer's process, too many or too few tests may be used. Existing test methods include:

Comparison of Several Main PCB softwares

The schematic design software will be available in ORCAD. The supported Netlist is much more than the industry standard.

PCB Design Preparation

Design requirements: The designer must read the schematic diagram in detail, fully communicate with the project engineer, understand the circuit architecture, understand the working principle of the circuit, and clearly understand the layout and routing requirements of key signals.

PCB Board Assembly Process Requirements

After the following procedures, the finishing work shall be undertaken by the operator responsible for PCB board testing and repair, unless otherwise arranged. The final installer shall be responsible for reviewing and correcting the reinstallation.

PCB Single Sided Production Process

Remarks: The grinding process between silk screen and solder mask may be omitted. It can be soldered first and then screen printed, depending on the substrate.

Introduction of PCB Material

PCB material are divided into: 94HB, fireproof board (94VO, FR-1, FR-2), semi-glass (22F, CEM-1, CEM-3), and full glass (FR-4).

Overview of PCB Via

Via is one of the important components of a multi-layer PCB. The cost of drilling is usually 30% to 40% of the cost of PCB board. Simply put, each hole in the PCB can be called a via.

Film

The film consists of a protective film, an emulsion layer, a bonding film, a film base and an antihalation layer. The main components are silver salt photosensitive materials, gelatin and pigments. Under the action of light, the silver salt can be reduced to the center of the silver core, but it is not dissolved in water. Therefore, it can be suspended in a gelatin state and coated on the substrate. The emulsion also contains a pigment to sensitize. The exposed film is then obtained by actinic action.