Introduction of PCB Material

FR-1:

Features:

1. Halogen-free sheet, good for environmental protection

2. High resistance to tracking index (above 600 volts, special requirements are required)

3. Suitable punching temperature is 40~70°C

4. Bow curvature, distortion rate is small and stable

FR-2:

Features: Excellent leakage resistance (600V or more)

5. Low cost and wide range of use

6. Excellent moisture and heat resistance

7. Suitable punching temperature is 40~70°C

8. Bow curvature, distortion rate is small and stable

9. Excellent dimensional stability

CEM-3:

Features: Excellent machinability, punchability

1. Electrical performance is equivalent to FR-4, processing technology is the same as FR-4, and the wear rate of the drill is smaller than FR-4

2. Multi-level traceability of leakage (CTI 175V, CTI300V, CTI 600V)

3. Meet the requirements of IPC-4101A

FR-4:

Features: Halogen-free, Br/Cl content below 0.09%

1.Antimony and red phosphor free, Absence of highly toxic dioxins in burning exhaust gas

2.Harder than KB-6160

The following are the product models: Paper Cladding Panel

KB-3152 FR-1

It is an environmentally friendly, halogen-free, bismuth-free paper-based phenolic resin copper laminate developed for environmental protection, which avoids the toxic substances and gases generated when the burning plate contains halogen and antimony. It has a high leakage index (above 600 volts) and is suitable for low temperature punching operations.

KB-3151S FR-1

It is a paper-based phenolic resin copper area laminate developed for the demand for precision circuit boards such as high-density automatic inserts and wafer surface adhesion technology. Excellent silver migration resistance and electrical properties in wet environments.

KB-3150/KB-3151

It is a paper-based phenolic resin copper area laminate newly developed for the demand for precision circuit boards such as high-density automatic inserts and wafer surface adhesion technology. It can have a high leakage index (above 600 volts) and is suitable for low temperature punching operations.

KB-3150 FR-1

It is a paper-based phenolic resin insulated laminate developed for precision components such as switch face boxes (such as piano switches and push switches). Excellent flame retardancy and dimensional stability, and suitable for low temperature punching operations.

KB-2151 FR-2

It is a paper-based phenolic resin copper area laminate developed for the demand for precision circuit boards such as high-density automatic inserts and wafer part surface adhesion technology.

KB-2150G/2150GC FR-2

It is an environmentally friendly, halogen-free, bismuth-free paper-based phenolic resin copper-area laminate developed for environmental protection, which avoids the toxic substances and gases generated when the burning plate contains halogen and antimony. It not only maintains the good performance of FR-2, but also is excellent in moisture resistance and heat resistance.

KB-150/1150/150D Unclad (ANSI: XPC)

It is a paper-based phenolic resin insulated laminate developed for the demand for precision components for mechanical transmission. It has good moisture and heat resistance and is suitable for low temperature punching operations.

KB-1150/KB-1151 ANSI XPC

It is a paper-based phenolic resin copper laminate with good moisture and heat resistance and is suitable for low-temperature punching.

The following are the product models: Fiberglass Cladding Panel

Prepreg FR-4

Jianye prepreg is obtained by curing the flame-retardant epoxy resin impregnated E-grade glass cloth to the "B" stage under precise temperature and weight control, so that it has stable rheological properties in the manufacturing process of the multilayer circuit board.

KB-7150 CEM-3

It is a composite base copper clad plate, which can be used as a single/double-sided circuit board instead of FR-4. It has good processability, reliability of metallized holes and resistance to moisture and heat.

KB-6167 FR-4

It is an epoxy glass cloth-based copper clad laminate with excellent heat resistance and mechanical properties. It can be used as a printed wiring board that requires high density and excellent heat resistance.

KB-6165 FR-4

Used in computers and peripheral equipment, communication equipment, instrumentation, office automation equipment, etc.

KB-6164 FR-4

It is an epoxy glass cloth-based copper clad laminate with the same performance and UV light blocking function as KB-6160. It is suitable for making printed circuit boards with UV blocking and AOI functions.

KB-6162 FR-4

It is an environmentally-friendly glass fiber cloth/epoxy-based copper clad laminate containing no toxic components such as halogen, antimony or red phosphorus. It is used in computers, computer peripherals, mobile phones, video cameras, televisions, and electronic game consoles.

KB-6160/6160C FR-4

It is an epoxy glass cloth-based copper clad with UV blocking function. Other properties are equivalent to those of KB-6150. It is suitable for boards with bidirectional simultaneous photocurable solder resist ink (UV) and optical automatic inspection (AOI).

KB-6150/6160 FR-4

Used in mobile phones, computers, testing equipment, video recorders, televisions, military equipment, steering systems, etc.

KB-6150/6150C FR-4

It is an epoxy glass cloth-based copper clad laminate that can be used as a single-sided/double-sided circuit board and multi-layer circuit board. Has good flame retardant properties and dimensional stability.

KB-6050/606X

Adapt to the suppression of multi-layer boards.

KB-5152 (GB: 22F)

Used in displays, video recorders, power boards, industrial instruments, digital recorders, etc.

KB-5150 CEM-1

It is a composite-based copper clad laminate, which combines the good processability of the paper substrate with the mechanical and dielectric properties of the glass cloth substrate, and is suitable for high frequency and circuit boards requiring punching.