Signal integrity and characteristic impedance of the device

Signal integrity issues can cause problems when you struggle to stabilize the various signals on the board. The IBIS model is an easy way to solve these problems. You can use the IBIS model to extract some important variables for signal integrity calculations and finding solutions for PCB design. The various values ​​you extract from the IBIS model are an integral part of signal integrity design calculations.

Circuit schematic entry knowledge

The significance, classification and composition of electronic circuit diagram

Summary of printed circuit board design experience

1. Printed circuit board size and device layout. 2. Decoupling capacitor configuration. 3. The heat dissipation design. 4. Electromagnetic compatibility design. 5. Ground wire design.

PCB high-speed 4 layers above layout experience

1. 3 points above the connection, as far as possible through the line in order to facilitate testing, the length of the line as short as possible.

Some Suggestions on PCB Design for Serpentine Lines

1. Try to increase the distance (S) between parallel lines, at least greater than 3H, and H refers to the distance the signal is routed to the reference plane. The popular saying is to walk around the big bend. As long as S is big enough, it can almost completely avoid the mutual coupling effect.

Techniques of PCB layout and processing defects

As the PCB size requirements are getting smaller and smaller, device density requirements are getting higher and higher, and PCB design is becoming more and more difficult. How to achieve a high PCB layout rate and shorten the design time, careful analysis of the design and careful setup of the tool software before starting the wiring will make the design more in line with the requirements.

The Significance of Impedance for PCB

What is the significance of impedance for the PCB? Why do impedance?

Analyze timing analysis and simulation strategy in high speed PCB design

In the field of network communication, in ATM switches, core routers, Gigabit Ethernet, and various gateway devices, the system data rate and clock rate continue to increase, and the operating frequency of the corresponding processor is also higher; data, voice, and image transmission.

PCB Routing - High Speed ​​PCB Design Guide

In the PCB design, wiring is an important step to complete the product design. It can be said that the previous preparation work is done for it. In the whole PCB, the wiring design process is the highest, the trick is the finest, and the workload is the largest. The PCB wiring has single-sided wiring, double-sided wiring, and multilayer wiring. There are two ways to route: automatic routing and interactive wiring. Before automatic routing, you can use interactive pre-wired lines that require more stringent requirements. The edges of the input and output should avoid adjacent parallel to avoid reflection interference. If necessary, ground wire should be isolated. The wiring of two adjacent layers should be perpendicular to each other, and parasitic coupling is easy to occur in parallel.

Handling Signal Integrity of High-Speed ​​Board Designs with Serial RapidIO Switching

This article focuses on signal integrity challenges involving high-speed interface design (the main features of RapidIO switching support these high-speed interface designs), and the ability to optimize RapidIO switching is designed to achieve high signal integrity in high-speed designs.

9 standards for RF in PCB design

In the low-power RF PCB design, the standard FR4 material is used (good insulation properties, uniform material, dielectric constant ε = 4, 10%).

How to Combined Shipments of Orders

148 Checklist for PCB Design, Part 1

1. The information received is completed (including: schematics, *.brd, bill of materials, PCB design and change requirements, standardization requirements, process design documents)

Advantages and Disadvantages of Different Surface Treatments of PCB

There are many types of surface treatment of circuit boards, which should be selected according to performance and requirements. The following are simple analysis of the advantages and disadvantages of various surface treatments of PCB.

Signal integrity issues for high speed DSP data acquisition

At present, the increasingly fine semiconductor process makes the transistor size smaller and smaller, so the signal transition of the device is faster and faster, the fast slope transient of the high-speed digital system and the extremely high operating frequency, and the large circuit density. This has led to signal integrity issues and electromagnetic compatibility issues in the field of high-speed digital circuit system design. Destroying signal integrity directly leads to signal distortion, timing errors, and incorrect data, address, and control signals, which can cause misoperations and even system crashes. Therefore, signal integrity issues have increasingly attracted the attention of high-speed digital circuit designers.

Design Model of High Speed Digital PCB Based on Signal Integrity Analysis

As integrated circuit output switching speeds increase and PCB board density increases, signal integrity has become one of the issues that must be addressed in high-speed digital PCB design. Factors such as components and PCB boards, layout of components on the PCB, and wiring of high-speed signals can cause signal integrity problems, resulting in unstable system operation or even no work at all.

Introduction of PCB Material

PCB material are divided into: 94HB, fireproof board (94VO, FR-1, FR-2), semi-glass (22F, CEM-1, CEM-3), and full glass (FR-4).

Summary of flexibility and reliability design of PCB

Flexible printed circuit boards can be classified according to the type of bending encountered during assembly and use. There are two design types, which are discussed below:

Routing rules for PCB high-speed boards of four or more layers

The PCB board is divided into many layers. What are the techniques for the high four-layer routing? Let me introduce you to the following.

PCB Board Assembly Process Requirements

After the following procedures, the finishing work shall be undertaken by the operator responsible for PCB board testing and repair, unless otherwise arranged. The final installer shall be responsible for reviewing and correcting the reinstallation.