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in the general news media as they relate to printed circuit board technology.
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Abstract: This paper systematically analyzes the various forms of power supply noise interference in high-frequency PCB boards and their causes. Through formula derivation and engineering experience, several corresponding countermeasures are proposed. Finally, the suppression of power supply noise should be followed. The general principle.
It can be classified according to PCB use, substrate type, structure, etc., and is generally divided by PCB structure.
51-100 POINTS
At present, the increasingly fine semiconductor process makes the transistor size smaller and smaller, so the signal transition of the device is faster and faster, the fast slope transient of the high-speed digital system and the extremely high operating frequency, and the large circuit density. This has led to signal integrity issues and electromagnetic compatibility issues in the field of high-speed digital circuit system design. Destroying signal integrity directly leads to signal distortion, timing errors, and incorrect data, address, and control signals, which can cause misoperations and even system crashes. Therefore, signal integrity issues have increasingly attracted the attention of high-speed digital circuit designers.
This is a big problem. We set aside other factors, just the PCB design aspects, share the following experience for reference exchange:
To solve signal integrity problems, it is best to have multiple tools to analyze system performance. If there is an A/D converter in the signal path, then when evaluating the circuit performance, it is easy to find three basic problems: all three methods evaluate the conversion process, as well as the conversion process and PCB layout and other parts of the circuit. Interaction. Three areas of concern relate to the use of frequency domain analysis, time domain analysis, and DC analysis techniques. This article will explore how to use these tools to determine the root cause of issues related to PCB layout and layout. We will study how to decide what to look for; where to find it; how to test the problem through testing; and how to solve problems found.
55 elements
1. 3 points above the connection, as far as possible through the line in order to facilitate testing, the length of the line as short as possible.
How to improve anti-interference ability and electromagnetic compatibility when developing electronic products with processors?
In circuit design, we are generally concerned about the quality of the signal, but sometimes we are often limited to the signal line for research, and the power and ground as the ideal situation to deal with, although this can simplify the problem, but in high-speed design This simplification is no longer feasible.
Flexible printed circuit boards can be classified according to the type of bending encountered during assembly and use. There are two design types, which are discussed below:
There are many popular EDA tools available on the market. However, these PCB design softwares are similar in terms of their use of terms and function keys. How do you use these tools to better implement PCB design? Careful analysis of the design before starting the wiring and careful setup of the tool software will make the design more compliant. The following is a general design process and steps.
Common PCB board level signal integrity analysis model
With the advancement of technology, the signal blocking time of high-speed integrated circuits has reached several hundred ps, and the clock frequency can reach several hundred MHz. Such a high edge rate causes a large number of interconnect lines on the printed circuit board to be produced in low-speed circuits. The transmission line effect causes distortion of the signal, which seriously affects the correct transmission of the signal. If the board design is not considered, the circuit with the correct logic function will not work properly when debugging. In order to solve this problem, signal integrity analysis must be carried out when designing high-speed circuits. The system is thoroughly simulated by virtual template, and the influence of circuit layout and routing on signal integrity is accurately analyzed, and the circuit design is guided. In this way, many problems that can be found in debugging can be solved during the design, which greatly improves the design success rate and shortens the design cycle.
This article will address the challenges faced by PCB design and what to consider as a PCB designer in evaluating a PCB design tool.
MOEMS packaging requirements are: resistance to mechanical and thermal shock, vibration and chemical resistance, and long life. Including wafer and wafer adhesion thickness, wafer cutting, die attach chip mounting process, thermal control, stress isolation, hermetic packaging, inspection and adjustment.
1. Try to increase the distance (S) between parallel lines, at least greater than 3H, and H refers to the distance the signal is routed to the reference plane. The popular saying is to walk around the big bend. As long as S is big enough, it can almost completely avoid the mutual coupling effect.
Common impedance interference is caused by a large number of ground lines on the PCB. When two or more loops share a ground line, different loop currents generate a certain voltage drop on the common ground. This voltage drop will affect the circuit performance when amplified. When the current frequency is high, it will be very The large inductive reacts to the circuit.
1-4 Measures taken to increase the system's ability of it.
(1) Cross circuit is not allowed in the printed circuit. For the lines that may cross, it can be solved by “drilling” or “winding”. That is, let a certain lead be "drilled" from the gap under other resistors, capacitors, and triodes, or "wrap" from one end of a lead that may cross. How to make the circuit complicated in special cases, to simplify the design It is allowed to bridge the wires to solve the cross circuit problem.
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