HDI PCBs

HDI is the abbreviation of the high-density interconnectors, and it is a technology of PCB manufacturing. HDI PCB is a type of PCB with a relatively high distribution density, which is using micro-blind buried hole technology. The compact product design using HDI PCB is very suitable for small-volume users. It has minor holes, finer lines and spaces, capture pads and higher connection pad density than standard PCBs. HDI PCBs are the best substitutes for traditional laminated boards.

The advantages of HDI PCBs

HDI PCB plays well in reducing the weight and size of the products and enhancing electrical performance. High-density interconnect PCB technology can be found in touch-screen devices, laptop computers, mobile phones, digital cameras, 4G network communications, even in medicals devices, and various aircraft parts and components. The main advantages are as below:

• Reduce PCB manufacturing cost: when the density of the PCB increases beyond the eight-layer board, the manufacturing cost using in HDI solution will be lower than the traditional complicated pressing process.
• Adding circuit density
• It is beneficial to advanced construction technology
• Better reliability
• Improve thermal properties
• Better electrical performance and signal correctness
• Improve design efficiency and
• Improve the situation of RFI/EMI/ESD

The applications of HDI PCBs

After knowing the various benefits of HDI PCBs in PCB prototype and PCB assembly processes, customers will have a better understanding of how beneficial the HDI PCBs can be in the PCB design and related industries.

HDI PCBs have been widely used in consumer electronics in consumer electronics mentioned above because of the small volume, fast speed, and high-frequency. Small is the constant pursuit of electronics products. The mainboard size can be reduced when adopting HDI technology, which will leave much space for battery and other additional function components, and reduce the cost of overall products.  

HDI PCBs technology makes it possible to achieve a more compact size of end-products while meeting the higher standards of electronic performance and efficiency. With the increased demands of the market and the upgrading of electronic products, HDI PCB technology will grow very quickly. 

Difficulties in HDI PCB manufacturing

HDI PCBs design is much complicated than previous PCBs; are not only the finer and closer circuits but also the design complexity using the interconnection of multi-layers will be increased dramatically. The compact circuits will decrease the conductor cross-sectional area of the line, which will lead to more transmission signal integrity problems. PCB designers should pay more attention to board functional verification and error check. 

HDI PCBs are generally manufactured using a build-up method. The more times the layers are laminated, the higher the technical board grade. Standard HDI circuit boards are one-time laminate, and high-level HDI boards need experience two or more times of lamination technology. And the processes require adopting advanced PCB manufacturing technologies, such as stacking holes, electroplating and filling holes, direct laser drilling.

If you have any plan of PCB prototype or PCB assembly, please do not hesitate to contact the online service or send E-mail to NextPCB. NEXTPCB can provide a one-stop service for you with competitive prices and the highest quality. The excellent manufacturing capability of customized HDI PCBs will help you to achieve your design goals and save costs.