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Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
The anti-jamming measures that are not common in some literatures are detailed below. Considering the practical application, especially in the trial production of products, double panels are still widely used. The following contents are mainly for double panels.
In this article, we will teach you how to do a PCB design easily 25-30
In the low-power RF PCB design, the standard FR4 material is used (good insulation properties, uniform material, dielectric constant ε = 4, 10%).
The following is an introduction to the testing experience and methods of resistors.
There are two main roles.
MOEMS packaging requirements are: resistance to mechanical and thermal shock, vibration and chemical resistance, and long life. Including wafer and wafer adhesion thickness, wafer cutting, die attach chip mounting process, thermal control, stress isolation, hermetic packaging, inspection and adjustment.
For the most basic PCB, the components are concentrated on one side, and the wires are concentrated on the other side. Because only one side can be wired, we call this PCB a single panel. Both sides of the double panel can be routed, so the wiring area is twice as large as that of a single panel, making it suitable for use on more complex circuits.
PCB Best Design Methodology: Six things to consider when passing a PCB schematic to a layout design. All examples mentioned in this article were developed using the Multisim design environment, but the same concepts apply when using different EDA tools.
25. Sensitive circuits or devices (such as reset circuits, WATCHDOG circuits, etc.) are at least 1000 mils away from the edge of the board, especially the interface edge of the board.
Signal integrity issues can cause problems when you struggle to stabilize the various signals on the board. The IBIS model is an easy way to solve these problems. You can use the IBIS model to extract some important variables for signal integrity calculations and finding solutions for PCB design. The various values you extract from the IBIS model are an integral part of signal integrity design calculations.
In SoC design, the coupling between signals can cause signal integrity problems. Neglecting signal integrity problems can lead to crosstalk between signals, and reliability, manufacturability and system performance will also be reduced.
There are indications that the frequency of PCB design is getting higher and higher. As the data rate continues to increase, the bandwidth required for data transfer also contributes to signal frequencies up to 1 GHz, or even higher. Although this high-frequency signal technology far exceeds the millimeter wave technology range (30GHz), it does involve RF and low-end microwave technologies.
PCB layout is the most important step in the design of electronic products. PCB layout and wiring will directly affect the performance of the circuit. Nowadays, although there are many softwares that can realize automatic PCB layout and routing, as signal frequencies continue to increase, engineers often need to understand the basic principles and techniques of PCB layout and routing to make their design perfect.
After the following procedures, the finishing work shall be undertaken by the operator responsible for PCB board testing and repair, unless otherwise arranged. The final installer shall be responsible for reviewing and correcting the reinstallation.
Q & A complete works
As integrated circuit output switching speeds increase and PCB board density increases, signal integrity has become one of the issues that must be addressed in high-speed digital PCB design. Factors such as components and PCB boards, layout of components on the PCB, and wiring of high-speed signals can cause signal integrity problems, resulting in unstable system operation or even no work at all.
In high speed designs, the characteristic impedance of the controllable impedance plates and lines is one of the most important and common problems. First, let's look at the definition of a transmission line: a transmission line consists of two conductors of a certain length, one for transmitting signals and the other for receiving signals (remember that the "loop" replaces the concept of "ground"). In a multi-layer board, each line is part of a transmission line, and an adjacent reference plane can be used as a second line or loop. The key to a line becoming a "good performance" transmission line is to keep its characteristic impedance constant throughout the line.
Common PCB circuit diagrams include four major types: schematics, block diagrams, assembly drawings, and printed board drawings.
In design, layout is an important part. The quality of the layout results will directly affect the effect of the wiring, so it can be considered that a reasonable layout is the first step in the success of PCB design.
The components should be arranged in a straight line in the order of the electrical schematics, and the compactness is required to shorten the length of the printed conductors and achieve a uniform assembly density. Under the premise of ensuring electrical performance requirements, the components shall be parallel or perpendicular to the board surface and parallel or perpendicular to the main board edge. It is evenly distributed on the board surface.
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