PCB Manufacturer & PCB Assembly

Engineer Summary: Signal Integrity Design Experience 100 (2)

Posted on August 07, 2018 by G

51-100 POINTS

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Engineer Summary: Signal Integrity Design Experience 100 (1)

Posted on August 07, 2018 by G

1-50 POINTS

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Review the requirements of power supply elements in PCB layout design

Posted on August 02, 2018 by G

Layer setting and power ground segmentation requirements; Power module requirements

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DFM requirements for viewing features in PCB layout design

Posted on August 02, 2018 by G

Thermal design requirements for layout; Layout signal integrity requirements; EMC requirements

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View layout elements in PCB layout design

Posted on August 02, 2018 by G

1-26 elements

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Summary of flexibility and reliability design of PCB

Posted on July 30, 2018 by G

Flexible printed circuit boards can be classified according to the type of bending encountered during assembly and use. There are two design types, which are discussed below:

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Inductance Analysis of Through Holes in Printed Circuit Boards

Posted on July 30, 2018 by G

For digital circuit designers, the inductance of the via is more important than the capacitance. Each via has a parasitic mid-inductance. Because the physical structure of the via is small, its characteristics are very lumped lumped circuit components. The main effect of the series inductance of the via is to reduce the effectiveness of the power supply bypass capacitor, which will make the overall power supply filtering effect worse.

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Power integrity design

Posted on July 26, 2018 by G

In circuit design, we are generally concerned about the quality of the signal, but sometimes we are often limited to the signal line for research, and the power and ground as the ideal situation to deal with, although this can simplify the problem, but in high-speed design This simplification is no longer feasible. Although the direct result of circuit design is manifested in signal integrity, we must not neglect the power integrity design. Because power integrity directly affects the signal integrity of the final PCB. Both power integrity and signal integrity are closely related, and in many cases, the main cause of signal distortion is the power system. For example, the ground bounce noise is too large, the design of the decoupling capacitor is not suitable, the loop effect is serious, the division of multiple power/ground planes is not good, the design of the ground layer is unreasonable, the current is not uniform, and the like.

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Signal integrity engineer job responsibilities

Posted on July 26, 2018 by G

Qualifications and main duties.

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Signal integrity SI engineers must have what conditions

Posted on July 26, 2018 by G

In a company, from a product-level perspective, what are the prerequisites for a signal integrity engineer, what they are doing, and a bystander's understanding is as follows:

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Impedance control for high speed circuit design

Posted on July 24, 2018 by G

The characteristic impedance of the control signal transmission path is kept constant, and the reflection coefficient is 0, which means that there is no reflection on the transmission path. This is called impedance matching. At this point the signal will be ideally delivered to the terminal.

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What aspects of good PCB design should be considered

Posted on July 24, 2018 by G

Six points

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What kind of PCB stacking strategy helps shield and suppress EMI?

Posted on July 19, 2018 by G

The following layered stacking scheme assumes that the supply current flows on a single layer, with single or multiple voltages distributed across different parts of the same layer. The case of multiple power planes is discussed later.

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The role of PCB layered stacking in controlling EMI radiation

Posted on July 19, 2018 by G

There are many ways to solve EMI problems. Modern EMI suppression methods include: using EMI suppression coatings, selecting suitable EMI suppression components, and EMI simulation designs. This article starts from the most basic PCB layout and discusses the role of PCB layered stacking in controlling EMI radiation.

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High Frequency PCB Routing Skills

Posted on July 19, 2018 by G

Digital devices are moving in the direction of high speed, low consumption, small size, and high anti-interference. This trend has put forward many new requirements for the design of printed circuit boards. The application of Protel software in China is quite common. However, many designers only pay attention to the Protel software's routing rate. The improvements made by Protel software to adapt to the changes of device characteristics are not used in the design, which not only makes software resources. The waste is more serious, and the excellent performance of many new devices is difficult to play. This paper intends to introduce Protel for Windows V1.5 software as an example to introduce the high-frequency circuit wiring when Protel software can Some special countermeasures are provided.

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Calculation of characteristic impedance

Posted on July 16, 2018 by G

We can derive the value of the characteristic impedance, which is the value of the instantaneous impedance seen by the signal during transmission.

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Characteristic impedance of the transmission line

Posted on July 16, 2018 by G

From a battery point of view, once the design engineer connects the battery leads to the front end of the transmission line, there is always a constant value of current flowing out of the battery and keeping the voltage signal constant. Some people may ask, what kind of electronic components have such behavior? A constant current value is maintained when a constant voltage signal is added, of course the resistance.

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Analyze Characteristic Impedance--Basic Concept

Posted on July 16, 2018 by G

In recent years, an increasingly important issue in the field of high-speed design has been the focus of design engineers on the design of controlled-impedance boards and the characteristic impedance of interconnects on boards.

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Tag: pcb transmission line PCB

Next Generation Design Tools Outlook

Posted on July 12, 2018 by G

To address signal integrity issues, the entire design process needs to be further upgraded to become a complete set of tools that can take into account multiple different effects and design assessments.

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Method for solving signal integrity problems in ASIC chip design

Posted on July 12, 2018 by G

For the design of ASIC (Application Specific Integrated Circuit), the performance of standard cells is wasted due to the application of standard cells, shorter development cycle, and more relaxed protection between cells. Therefore, the key to high-end ASIC chip design is to ensure high-performance chips are delivered with shorter development time.

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Engineer Summary: Signal Integrity Design Experience 100 (2)

Engineer Summary: Signal Integrity Design Experience 100 (1)

Review the requirements of power supply elements in PCB layout design

DFM requirements for viewing features in PCB layout design

View layout elements in PCB layout design

Summary of flexibility and reliability design of PCB

Inductance Analysis of Through Holes in Printed Circuit Boards

Power integrity design

Signal integrity engineer job responsibilities

Signal integrity SI engineers must have what conditions

Impedance control for high speed circuit design

What aspects of good PCB design should be considered

What kind of PCB stacking strategy helps shield and suppress EMI?

The role of PCB layered stacking in controlling EMI radiation

High Frequency PCB Routing Skills

Calculation of characteristic impedance

Characteristic impedance of the transmission line

Analyze Characteristic Impedance--Basic Concept

Next Generation Design Tools Outlook

Method for solving signal integrity problems in ASIC chip design

Categories

Recommended Article:

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Engineer Summary: Signal Integrity Design Experience 100 (2)

Engineer Summary: Signal Integrity Design Experience 100 (1)

Review the requirements of power supply elements in PCB layout design

DFM requirements for viewing features in PCB layout design

View layout elements in PCB layout design

Summary of flexibility and reliability design of PCB

Inductance Analysis of Through Holes in Printed Circuit Boards

Power integrity design

Signal integrity engineer job responsibilities

Signal integrity SI engineers must have what conditions

Impedance control for high speed circuit design

What aspects of good PCB design should be considered

What kind of PCB stacking strategy helps shield and suppress EMI?

The role of PCB layered stacking in controlling EMI radiation

High Frequency PCB Routing Skills

Calculation of characteristic impedance

Characteristic impedance of the transmission line

Analyze Characteristic Impedance--Basic Concept

Next Generation Design Tools Outlook

Method for solving signal integrity problems in ASIC chip design

Categories

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