PCB Manufacturer & PCB Assembly | Advanced Circuits

Techniques of PCB layout and processing defects

Posted on June 05, 2018 by G

As the PCB size requirements are getting smaller and smaller, device density requirements are getting higher and higher, and PCB design is becoming more and more difficult. How to achieve a high PCB layout rate and shorten the design time, careful analysis of the design and careful setup of the tool software before starting the wiring will make the design more in line with the requirements.

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PCB Design Process - Introduction to DFM

Posted on June 05, 2018 by G

Allow enough test interfaces to facilitate ICT testing

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To solve EMC, how to solve the ground first?

Posted on June 05, 2018 by G

EMC, including EMI/ESD issues, is usually 80-90% related to grounding design. The most likely EMI/ESD problems are the grounding of analog, digital, and power supplies, as well as grounding methods.

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PCB layout and system test

Posted on June 01, 2018 by G

The basic principles of high-speed PCB layout are as follows:

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POWERPCB design layout knowledge

Posted on June 01, 2018 by G

There are also two ways of layout, manual routing and automatic routing. PowerPCB provides manual routing capabilities that are powerful, including automatic push and online design rule checking (DRC). Automatic routing is performed by Specctra's cabling engine. Usually these two methods work together. The common steps are manual-auto-manual.

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High Speed PCB Design Rules Summary and Analysis (2)

Posted on May 29, 2018 by G

25. Sensitive circuits or devices (such as reset circuits, WATCHDOG circuits, etc.) are at least 1000 mils away from the edge of the board, especially the interface edge of the board.

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High Speed PCB Design Rules Summary and Analysis (1)

Posted on May 29, 2018 by G

1. PCB clock frequency exceeds 5MHZ or signal rise time is less than 5ns, generally requires the use of multi-layer board design.

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PCB design layout experience summary

Posted on May 29, 2018 by G

PCB layout is the most important step in the design of electronic products. PCB layout and wiring will directly affect the performance of the circuit. Nowadays, although there are many softwares that can realize automatic PCB layout and routing, as signal frequencies continue to increase, engineers often need to understand the basic principles and techniques of PCB layout and routing to make their design perfect.

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Basic Methods for Minimizing RF Effect in PCB Interconnect Design

Posted on May 25, 2018 by G

This article describes various techniques for three types of interconnect design, including device mounting methods, wiring isolation, and measures to reduce lead inductance.

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Tag: PCB design pcb design pcb board pcb board interconnection

RF Design: Electromagnetic Properties at Interconnect Points

Posted on May 25, 2018 by G

There are indications that the frequency of PCB design is getting higher and higher. As the data rate continues to increase, the bandwidth required for data transfer also contributes to signal frequencies up to 1 GHz, or even higher. Although this high-frequency signal technology far exceeds the millimeter wave technology range (30GHz), it does involve RF and low-end microwave technologies.

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Checking List After Drawing a Package

Posted on May 21, 2018 by G

(1) Is the pin pitch correct? If the answer is no, it is very likely that you will not even get a weld.

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About the experience of drawing PCB package

Posted on May 21, 2018 by G

It's not easy to think about packaging well:

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Tag: pcb PCB PCB package pcb assembled

Some Suggestions on PCB Design for Serpentine Lines

Posted on May 21, 2018 by G

1. Try to increase the distance (S) between parallel lines, at least greater than 3H, and H refers to the distance the signal is routed to the reference plane. The popular saying is to walk around the big bend. As long as S is big enough, it can almost completely avoid the mutual coupling effect.

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About circuit division in Protel

Posted on May 16, 2018 by G

Protel99's electrical layer is divided into two types, open a PCB design document press, shortcut L, there is a layer settings window. The SIGNAL LAYER on the left is a positive layer, including TOP LAYER, BOTTOM LAYER, and MIDLAYER, and the middle one (INTERNAL PLANES) is a negative layer, ie INTERNAL LAYER. Both layers have completely different properties and methods of use.

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Tag: circuit division pcb inner layers electrical layer division

How to Solve Signal Integrity Problems in PCB Design and Layout

Posted on May 16, 2018 by G

To solve signal integrity problems, it is best to have multiple tools to analyze system performance. If there is an A/D converter in the signal path, then when evaluating the circuit performance, it is easy to find three basic problems: all three methods evaluate the conversion process, as well as the conversion process and PCB layout and other parts of the circuit. Interaction. Three areas of concern relate to the use of frequency domain analysis, time domain analysis, and DC analysis techniques. This article will explore how to use these tools to determine the root cause of issues related to PCB layout and layout. We will study how to decide what to look for; where to find it; how to test the problem through testing; and how to solve problems found.

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Some basic concepts of PCB design

Posted on May 14, 2018 by G

The concepts of Layer, Via, Overlay, Pad, Mask, etc.,

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How to design anti-interference circuit

Posted on May 14, 2018 by G

This article analyzes the causes of various interference through several typical examples. It also introduces some special rules in the design of PCB and the requirements of anti-jamming design.

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MOEMS packaging technology

Posted on May 11, 2018 by G

MOEMS packaging technology can be divided into several major aspects of die fixing, housing, wiring and optical interconnection. In MOEMS, commercial devices require a practical MOEMS hybrid reliable and safety shielded package. Due to the non-contact and non-insertion of optics, the packaging of PCB design MOEMS devices is much easier than the packaging of MEMS devices, and MEMS designs can be utilized, but excellent and reliable light alignment is required.

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MOEMS packaging requirements

Posted on May 11, 2018 by G

MOEMS packaging requirements are: resistance to mechanical and thermal shock, vibration and chemical resistance, and long life. Including wafer and wafer adhesion thickness, wafer cutting, die attach chip mounting process, thermal control, stress isolation, hermetic packaging, inspection and adjustment.

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PCB Design MOEMS Technology and Packaging

Posted on May 11, 2018 by G

The Micro-Electro-Mechanical System (MOEMS) is an emerging technology that has recently become one of the hottest technologies in the world. MOEMS is a micro-electro-mechanical system (MEMS) that uses an optical subsystem. It contains micro-mechanical light modulators, micro-mechanical optical switches, ICs, and other components, and utilizes the miniaturization, multiplicity, and microelectronics of MEMS technology. Seamless integration of optical devices and electrical devices. Simply put, MOEMS is a further integration of system-level chips. Compared with large-scale opto-mechanical devices, PCB design MOEMS devices are smaller, lighter, and faster (having a higher resonant frequency) and can use mass production techniques. Compared with the waveguide mode, this free space mode has the advantages of lower coupling loss and smaller crosstalk. The changes in photonics and information technology directly promote the development of MOEMS. Figure 1 shows the relationship between microelectronics, micromechanics, optoelectronics, fiber optics, MEMS and MOEMS. Nowadays, information technology is rapidly developing and constantly updated. By 2010, the speed of light can reach Tb/s. The ever-increasing data rate and the demand for higher-performance next-generation devices have driven the demand for MOEMS and optical interconnects, and the application of PCB design MOEMS devices in the field of optoelectronics continues to grow.

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Techniques of PCB layout and processing defects

PCB Design Process - Introduction to DFM

To solve EMC, how to solve the ground first?

PCB layout and system test

POWERPCB design layout knowledge

High Speed PCB Design Rules Summary and Analysis (2)

High Speed PCB Design Rules Summary and Analysis (1)

PCB design layout experience summary

Basic Methods for Minimizing RF Effect in PCB Interconnect Design

RF Design: Electromagnetic Properties at Interconnect Points

Checking List After Drawing a Package

About the experience of drawing PCB package

Some Suggestions on PCB Design for Serpentine Lines

About circuit division in Protel

How to Solve Signal Integrity Problems in PCB Design and Layout

Some basic concepts of PCB design

How to design anti-interference circuit

MOEMS packaging technology

MOEMS packaging requirements

PCB Design MOEMS Technology and Packaging

Categories

Recommended Article:

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Techniques of PCB layout and processing defects

PCB Design Process - Introduction to DFM

To solve EMC, how to solve the ground first?

PCB layout and system test

POWERPCB design layout knowledge

High Speed ​​PCB Design Rules Summary and Analysis (2)

High Speed ​​PCB Design Rules Summary and Analysis (1)

PCB design layout experience summary

Basic Methods for Minimizing RF Effect in PCB Interconnect Design

RF Design: Electromagnetic Properties at Interconnect Points

Checking List After Drawing a Package

About the experience of drawing PCB package

Some Suggestions on PCB Design for Serpentine Lines

About circuit division in Protel

How to Solve Signal Integrity Problems in PCB Design and Layout

Some basic concepts of PCB design

How to design anti-interference circuit

MOEMS packaging technology

MOEMS packaging requirements

PCB Design MOEMS Technology and Packaging

Categories

Recommended Article:

High Speed PCB Design Rules Summary and Analysis (2)

High Speed PCB Design Rules Summary and Analysis (1)