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HDI PCB is characterized by high-density features, including laser micro vias, fine lines, and high-performance thin materials. This increased density can support more functions per unit area. because of its higher circuit density than normal PCBs, the design of HDI PCB can incorporate finer lines and spacing, smaller through holes and pads, and higher connection with pad density. HDI PCBs have blind vias and buried vias, and generally contain micro vias with a diameter of 0.006 or less.
This has promoted major advances in mobile phones, computer products, and other new products. Including touch screen computers, 4G communications, and military applications, such as avionics and smart military equipment.
The birth of HDI PCB brings more possibilities for portable electronic devices and also brings more challenges to PCB manufacturers. In order to adapt to the miniaturization and multi-function trend of electronic products, NextPCB has made a lot of efforts to improve the level of equipment and the professional level of employees. You can provide us with HDI design, we will provide you with satisfactory services and HDI products.
We have the ability to manufacture up to 20 layers of HDI PCB in various capabilities, please check the table below for the available HDI PCB capabilities:
Items |
Manufacturing Capabilities |
Layer Count |
4-20 Layers |
Quality Level |
IPC 6012 2,IPC 6012 3 |
Materials |
g 140°C FR4,Tg 150°C FR4,Tg 170°C FR4,Special Materials |
Board Thickness |
0.4-6.0mm |
Min. Trace/Min. Trace Spacing |
≥3mil |
Min. hole size |
0.15mm-0.3mm |
Solder Mask |
We have green, red, white, yellow, blue, black, and matte black solder mask color. |
Legend |
white, yellow, blue, black |
Surface Finish |
Tin / Lead Solder (HASL), ENIG,OSP |
Finished Copper Weight |
0.5-13oz |
Material: Fr-4
Layer Count: 6 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 3/3mil
Min. Drilled Hole: 0.25mm
Via Process: Tenting Vias
Surface Finish: ENIG
Material: Fr-4(+RCC)
Layer Count: 10 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 3/3mil
Min. Drilled Hole: 0.125mm
Via Process: Tenting Vias
Surface Finish: ENIG
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