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in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
When designing the PCB board, the most consideration for our wiring is how to connect each layer to the network signal line in the most reasonable way. The denser the high-speed PCB board circuit, the greater the density of vias (VIA) is placed, and the vias can serve each layer. The role of electrical connection between.
To make the designed circuit board achieve the expected purpose, the overall layout of the printed circuit board and the placement of the components play a key role, which directly affects the installation, reliability, ventilation, and heat dissipation of the entire printed circuit board and the direct connection of wiring rate.
For many years, the only way to integrate more functions into a printed circuit board was to increase the board geometry and increase the number of layers.
A motherboard mechanically sustains as well as links digital parts making use of conductive paths. After a circuit board is produced, digital parts need to be attached to it to create a practical circuit setting up.
Hence creating brand-new items constantly require making use of high-frequency substratum, satellite system, mobile telephone getting base station, and so forth, these interaction items need to utilize high-frequency PCB.
Development of PCB Wiring Technology,from the perspective of past developments, every update of the packaging and manufacturing process promotes the change of the router, so that the performance and efficiency of the router are greatly improved.
EI: Electromagnetic interference, is widely found in various types of electrical and electronic equipment. Various types of electrical and electronic equipment emit electromagnetic waves more or less when they work.
Should be avoided as far as possible in the fine pitch components between the pads through the connection, indeed need to cross the connection between the pads, the use of solder mask to be a reliable cover.
With the first ever KiCad conference coming to Asia next week, what better opportunity to commemorate the occasion with a SAO badge designed with KiCad.
SMD Adhesive is likewise called Surface area Mount Adhesive.SMD Adhesive Features.SMD adhesive must have the complying with Features.
SiC (Silicon Carbide) is a compound semiconductor material composed of Si (silicon) and C (carbon).
Preface: To ensure a good PCB solderability or electrical properties. Because copper tends to be present in the form of oxides in the air, seriously affecting the solderability and the electrical properties of the PCB, the PCB needs to be surface-finish.
Industrial robots are not only declining in price, but their functions are also increasing. Through the combination of artificial intelligence software, machine vision, and other sensing systems, industrial robots will gain the ability to learn new skills and can further replace humans. work.
Good news: A Big Sale on NextPCB, Only $28, you could own 10pcs of 4-layer PCB.
RS274D VS RS274X Gerber RS274D Typical Gerber was the very first variation of the PCB documents layout generated by any type of CAD (Computer System Helped Style) system.
Layout considerations
Some experience in reducing noise and electromagnetic interference
It is necessary"to examine MIL-PRF-50884, MIL-PRF-31031, as well as MIL-PRF-55110 criteria to make sure that the PCBs that are being produced autumn in line with the specifications.
The reuse function provides design duplication for powerpcb (ie, a system that implements a modular design). For the successful use of the reuse function, we greatly improve our work efficiency; and we can call some successful designs and high-performance modules in the new design, thus improving the success rate of our new product pcb design.
Two property aspects are of interest: the ability of a circuit to generate the lowest (or zero) interference, and the immunity of a circuit to the effects of the electromagnetic energy it is subjected to. This application report explains important criteria that determine the EMC of a circuit and, thus, provides the development engineer with information for the design of circuits and layout of circuit boards.
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