Multi-level or Step Stencil

What is Multi-level/ step stencil?

Partial BOOST stencil, as well as partial STEP-DOWN stencil, are performed on the steel sheet to make the exact same printing on the very same stencil, to ensure that various locations can acquire various densities of solder paste. According to the efficiency of elements, the dimension of link end as well as the lands, it can properly manage the quantity of solder paste which related to the various parts are properly managed to make the solder paste printing process reliable and also precise. A Ladder stencil suggests using a squeegee for much better outcomes.

1. STEP-DOWN stencil

For accuracy PCBs with IC pitch 0.4 mm and also large-sized spot products such as board owners as well as earphone owners, thicker steel sheets can be utilized to attain the quantity of tin in the earphone owner, and also Accuracy ICs can not abide by tin and also produce various other unfavorable sensations. The accuracy IC can be properly managed by STEP-DOWN stencil, to ensure that the quantity of solder paste can be properly put on various parts to make the solder paste printing process reliable and also exact.

2. BOOST stencil

BOOST stencil is mostly for big products such as USB, earphone owner, board owner, component, switch, and so on. As an example, an item of accuracy product on a PCB requires to utilize 0.1 mm thick steel sheet, and also the quantity of tin in private huge products which fall short to satisfy the requirements will certainly lead to unfavorable sensations such as absence of tin, digital welding, as well as incorrect welding. The placement of the huge product can be in your area enlarged by 0.15 mm, and also the convex action layer is reviewed the steel sheet, therefore enhancing the quantity of tin in the defined product, efficiently regulating the incident of unwanted sensations, as well as precisely using the solder paste to various parts ， making the printing process of solder paste effective as well as exact. Partly enlarged steel mesh can additionally get rid of the trouble that some components are not flat sufficient.

  PCB Stencil Quote  

Step Stencil Technical Information

To enhance or reduce the quantity of solder paste for one or some particular gadgets! We can attain the thickening, thinning as well as multi-layer actions of the defined placement on the very same steel grid, specifically 0.08 MM 0.1 MM 0.12 MM 0.15 MM 0.2 M 0.25 MM 0.3 MM.

The manufacturing of Action stencils

The Action Stencils requires to be integrated by engraving procedure and also laser procedure.

1. Chemical engrave

Refine circulation: Data File PCB → Movie Manufacturing → Picture Subject → Photo Create → Copper Etch → Steel Sheet Cleansing → Steel Sheet Draining Pipes
Functions: The action steel sheet addresses the issue of an unwanted of tin as well as absence of tin in the spot. And also it is the only procedure that can create action steel sheets.
Downsides: too much manufacturing web links, a lot of collective mistakes, time consuming, harsh surface area, not eco-friendly, pricey.

2. Laser reducing

Refine circulation: repair action steel sheet → take works with → laser equipment coordinate positioning → laser reducing → grinding → securing web
Attributes: high accuracy of information manufacturing, little influence of unbiased aspects; trapezoidal opening contributes to demoulding; can be utilized for accuracy cutting.
Downsides: It is hard to take the coordinate positioning procedure, hence leading to sluggish rate.