SMT Assembly Capabilities

SMT is short of Surface Mount technology, which is a technology of mounting and soldering the surface mount components onto a printed circuit board(PCB). SMT is currently the most popular technology and process in the electronics assembly industry.

The significant of the SMT

The most important part of the electronic products we usually use is the PCBs， which mounted various capacitors, resistors, and other components according to the design of the circuit diagram. All kinds of electrical appliances need the SMT to process.

Nowadays, the through-hole components technology has not been able to meet the demands of miniaturization and functional diversification of electronic products. Together with the development of high-integration IC promoted the birth of SMT assembly components. SMT production technology is widely used in mass production by using advanced but economical equipment. SMT has many advantages, such as reducing the volume and weight of the devices, improving performance, and lower costs. Applications from communications, automotive, aviation, to medical electronics have widely applied SMT in PCB manufacturing.

The main workflow of SMT assembly

l First step: printing

After aligning the PCB stencil on the board surface, solder paste is applied on the pads. A squeegee is needed in this process to ensure the pads are coated with an exact amount and uniform solder paste.

l Second step: mounting

The components are mounted on the board in their positions by using the pick and place machine or hand placement. The wet solder paste is the temporary adhesive, and the PCB should be moved gently to prevent misalignment.

l Third step: reflow soldering

The mounted PCBs will pass through the reflow oven, and the solder paste will be melted and formed solder joints after subjecting infrared radiation.

l Fourth step: cleaning

The washing machine will remove the harmful solder residue on the assembled PCBs, such as flux, etc.

l Final step: inspection

At this step, the boards will pass through the automatic optical inspection(AOI), which runs the quality check on the board visually. And then proceed to other tests.

NextPCB owns a highly automated SMT assembly house with complete PCB assembly abilities. SMT workshop has been assembling SMT designs for nearly ten years. The advanced equipment, highly trained PCB engineers, and strictly quality control system form an experienced SMT assembly team. Our completely computerized SMT production line allows the achievement of extremely high accuracy and high throughput. Manual production is also available for the complex parts, small-batch, or prototype products.

The following SMT types are available in NextPCB:

l Ball Grid Array(BGA)

l Ultra-Fine Ball Grid Array(UBGA)

l Quad Flat Package(QFP)

l Quad Flat Pack No-lead(QFN)

l Package-On-Package(POP)

l Small Outline Integrated Circuit(SOIC)

l Plastic Leaded Chip Carrier(PLCC)

Except for the types mentioned above, NextPCB also provides various other small chip packages that have a pitch of 0.2mm or larger. Our PCB assembly process will be carefully matched to your PCB design and specific requirements. When you choose us, you only need to focus on your design but do not have to think about the details of production. NEXPCB can satisfy all the requirements in your SMT prototype PCB assembly or low-volume PCB production.

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