Support Team
Feedback:
support@nextpcb.comHere you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
The following layered stacking scheme assumes that the supply current flows on a single layer, with single or multiple voltages distributed across different parts of the same layer. The case of multiple power planes is discussed later.
PCB interconnect design techniques include testing, simulation, and various related standards, where testing is the method and means to verify the results of various simulation analyses. Excellent test methods and means are necessary to ensure the analysis of PCB interconnection design. For traditional signal waveform testing, the main focus should be on the length of the probe leads to avoid unnecessary noise introduced by Pigtail. This article focuses on new applications and development of interconnect testing techniques.
With the increase of package density and the increase of operating frequency, the signal integrity problem in MCM circuit design can not be ignored. Taking the detector circuit as an example, this paper firstly uses APD software to realize the layout and layout design of the circuit, and then combines the signal integrity analysis to adjust the circuit layout and wiring structure repeatedly. The final Spectra Quest software simulation results show that the improved circuit layout and routing Meet signal integrity requirements while maintaining high simulation accuracy.
In high-speed circuit design, the traditional approach to locating signal integrity problems is to use hardware triggers to isolate events and/or to capture events using deep acquisition storage techniques before looking for problems. As the speed and complexity of high-performance circuit systems continue to increase, the limitations of using oscilloscopes to locate signal integrity problems are becoming more prominent.
Thermal design requirements for layout; Layout signal integrity requirements; EMC requirements
1-50 POINTS
1. 3 points above the connection, as far as possible through the line in order to facilitate testing, the length of the line as short as possible.
4 methods and solutions
For the design of ASIC (Application Specific Integrated Circuit), the performance of standard cells is wasted due to the application of standard cells, shorter development cycle, and more relaxed protection between cells. Therefore, the key to high-end ASIC chip design is to ensure high-performance chips are delivered with shorter development time.
The differential signal pairs with very close wirings are also closely coupled to each other. This mutual coupling reduces EMI emissions. The main disadvantage of differential signal lines is the increased PCB area. This paper introduces the circuit board design process. Wiring strategy for differential signal line routing.
For digital circuit designers, the inductance of the via is more important than the capacitance. Each via has a parasitic mid-inductance. Because the physical structure of the via is small, its characteristics are very lumped lumped circuit components. The main effect of the series inductance of the via is to reduce the effectiveness of the power supply bypass capacitor, which will make the overall power supply filtering effect worse.
Right-angle alignment is generally required in pcb cabling to avoid the situation, but also almost one of the standards to measure the quality of the cabling, then the right angle of the trace will have much impact on the signal transmission? In principle, a right-angled trace will cause the linewidth of the transmission line to change, resulting in an impedance discontinuity. In fact, not only the right-angle traces, but also the angles of sharp angles and acute angles may cause impedance changes.
The below describes several EDA software commonly used in circuit design. There are many EDA softwares in this industry, such as transformer design, electrical design, integrated circuit design, etc., as well as a variety of microcontrollers. Simulation software.
PCB design tools have grown steadily in recent years to address the challenges of this increasingly complex design landscape. A major change – the adoption of 3D capabilities, is expected to allow designers to balance design innovation with the competitiveness of the global marketplace.
1. Right angle line (three aspects) 2. Differential traces ("equal length, equidistant, reference plane") 3. The snake line (adjustment delay)
In SoC design, the coupling between signals can cause signal integrity problems. Neglecting signal integrity problems can lead to crosstalk between signals. Reliability, manufacturability and system performance will also be reduced. This article describes the design of ASIC chips. A method for solving signal integrity problems.
The PROTEL99 electrical layer is divided into two types, the positive layer and the negative layer. These two layers have completely different properties and usage methods.
In the PCB layout, the handling of the power and ground wires is very important. The noise interference generated by the power cables and ground wires should be minimized to ensure the quality of the products.
PowerPCB enables users to achieve high-quality design and vividly reflects all aspects of the electronics design industry. Its constraint-driven design approach reduces product completion time. You can define safety spacing, routing rules, and design rules for high-speed circuits for each signal, and apply these plans hierarchically to the board, to each layer, to each type of network, to each network, to each group. On the network, each pin is placed to ensure the correctness of the layout design. It includes a wide range of features including clustering tools, dynamic routing editing, dynamic electrical performance checks, automatic dimensioning and powerful CAM output capabilities. It also has the ability to integrate third-party software tools such as the SPECCTRA router.
The moisture sensitivity of plastic integrated circuits (ICs) is getting worse and worse, due to many industry trends, including the constant search for higher reliability products to support critical communications and technology applications.
Dimensions: (mm) |
|
Quantity: (pcs) |
|
Layers: |
Thickness: |
Quote now |