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in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
The basic principles of high-speed PCB layout are as follows:
Many people say that pcb design is an art. This sentence is not wrong, but it is not a purely artistic appreciation but a practical art combined with electronic science. Electrical performance is always the most important pursuit of PCB design, and it is the primary goal. Do not give up electrical performance in order to pursue orderliness and beauty. But then again, PCBs that achieve the best electrical performance are generally pretty beautiful.
In the PCB layout, the handling of the power and ground wires is very important. The noise interference generated by the power cables and ground wires should be minimized to ensure the quality of the products.
PCB design tools have grown steadily in recent years to address the challenges of this increasingly complex design landscape. A major change – the adoption of 3D capabilities, is expected to allow designers to balance design innovation with the competitiveness of the global marketplace.
Designers may design odd-numbered printed circuit boards (PCBs). If the wiring does not require an extra layer, why use it? Isn't reducing layers not making the board thinner? If the board is one less layer, is the cost lower? However, in some cases, adding a layer will reduce the cost.
Reasonable layout of components is the basic premise for designing high quality PCB drawings. The requirements for component layout mainly include installation, stress, heat, signal and aesthetic requirements.
To solve signal integrity problems, it is best to have multiple tools to analyze system performance. If there is an A/D converter in the signal path, then when evaluating the circuit performance, it is easy to find three basic problems: all three methods evaluate the conversion process, as well as the conversion process and PCB layout and other parts of the circuit. Interaction. Three areas of concern relate to the use of frequency domain analysis, time domain analysis, and DC analysis techniques. This article will explore how to use these tools to determine the root cause of issues related to PCB layout and layout. We will study how to decide what to look for; where to find it; how to test the problem through testing; and how to solve problems found.
Since the printed circuit board is not a general end product, the definition of the name is slightly confusing. For example, the motherboard for the personal computer is called the motherboard and cannot be directly called the circuit board. Although there is a circuit board in the motherboard, It's not the same, so when you evaluate the industry, you can't say the same thing. For example, because there are integrated circuit parts on the board, the news media called him an IC board, but in fact he is not equivalent to a printed circuit board.
As device operating frequencies become higher and higher, the signal integrity issues faced by high-speed PCB design become a bottleneck in traditional design, and engineers face increasing challenges in designing complete solutions. Although the high-speed simulation tools and interconnect tools can help designers solve some of the problems, high-speed PCB design requires more experience and deep communication between the industry.
Digital devices are moving in the direction of high speed, low consumption, small size, and high anti-interference. This trend has put forward many new requirements for the design of printed circuit boards. The application of Protel software in China is quite common. However, many designers only pay attention to the Protel software's routing rate. The improvements made by Protel software to adapt to the changes of device characteristics are not used in the design, which not only makes software resources. The waste is more serious, and the excellent performance of many new devices is difficult to play. This paper intends to introduce Protel for Windows V1.5 software as an example to introduce the high-frequency circuit wiring when Protel software can Some special countermeasures are provided.
Printed circuit manufacturers want to use good dry film to ensure the quality of printed boards, stable production and improve efficiency. In recent years, with the rapid development of the electronics industry, the precision density of printed boards has been continuously improved. In order to meet the needs of printed board production, new dry film products have been introduced, and the performance and quality have been greatly improved and improved.
In the low-power RF PCB design, the standard FR4 material is used (good insulation properties, uniform material, dielectric constant ε = 4, 10%).
Radiated EMI interference can come from an undirected source and an unintentional antenna. Conductive EMI interference can also come from a source of radiated EMI interference or caused by some board components. Once your board receives conductive interference, it resides in the PCB trace of the application circuit. Some common sources of radiated EMI interference include the components discussed in previous articles, as well as on-board switching power supplies, cables and switches, or clock networks.
EMC, including EMI/ESD issues, is usually 80-90% related to grounding design. The most likely EMI/ESD problems are the grounding of analog, digital, and power supplies, as well as grounding methods.
1. Try to increase the distance (S) between parallel lines, at least greater than 3H, and H refers to the distance the signal is routed to the reference plane. The popular saying is to walk around the big bend. As long as S is big enough, it can almost completely avoid the mutual coupling effect.
The high precision of printed circuits refers to the use of fine line width/pitch, micro holes, narrow ring width (or no ring width), and buried, blind holes and other technologies to achieve high density. The high precision means that the result of "fine, small, narrow, thin" will inevitably bring high precision. Take the line width as an example: O.20mm line width, and O.16-0.24mm is qualified according to the regulations. The error is (O.20 soil 0.04) mm; and the line width of O.10mm, the same error is (0.10±O.02) mm, obviously the accuracy of the latter is doubled, and so on is not difficult to understand. Therefore, the high precision requirements are not discussed separately. But it is a prominent problem in production technology.
The components should be arranged in a straight line in the order of the electrical schematics, and the compactness is required to shorten the length of the printed conductors and achieve a uniform assembly density. Under the premise of ensuring electrical performance requirements, the components shall be parallel or perpendicular to the board surface and parallel or perpendicular to the main board edge. It is evenly distributed on the board surface.
1. How to choose PCB board?
Many people think that the work of PCB Layout is very boring. Every day, thousands of wires are routed to the board, and various packages are repeated, and the work of pulling the wires is repeated. However, designers must make trade-offs between various design rules, taking into account performance, cost, process and other aspects, but also notice that the layout of the board is neat and tidy, not as simple as it seems, and requires more wisdom. Let's talk about developing some good work habits during design, which will make your design more reasonable, easier to produce, and better.
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