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in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
The high precision of printed circuits refers to the use of fine line width/pitch, micro holes, narrow ring width (or no ring width), and buried, blind holes and other technologies to achieve high density. The high precision means that the result of "fine, small, narrow, thin" will inevitably bring high precision. Take the line width as an example: O.20mm line width, and O.16-0.24mm is qualified according to the regulations. The error is (O.20 soil 0.04) mm; and the line width of O.10mm, the same error is (0.10±O.02) mm, obviously the accuracy of the latter is doubled, and so on is not difficult to understand. Therefore, the high precision requirements are not discussed separately. But it is a prominent problem in production technology.
The components should be arranged in a straight line in the order of the electrical schematics, and the compactness is required to shorten the length of the printed conductors and achieve a uniform assembly density. Under the premise of ensuring electrical performance requirements, the components shall be parallel or perpendicular to the board surface and parallel or perpendicular to the main board edge. It is evenly distributed on the board surface.
1. How to choose PCB board?
Many people think that the work of PCB Layout is very boring. Every day, thousands of wires are routed to the board, and various packages are repeated, and the work of pulling the wires is repeated. However, designers must make trade-offs between various design rules, taking into account performance, cost, process and other aspects, but also notice that the layout of the board is neat and tidy, not as simple as it seems, and requires more wisdom. Let's talk about developing some good work habits during design, which will make your design more reasonable, easier to produce, and better.
At present, electronic equipment is used in various electronic devices and systems, and printed circuit boards are still the main assembly method. Practice has proved that even if the schematic design of the circuit is correct and the printed circuit board is not properly designed, it will adversely affect the reliability of the electronic device. For example, if the two thin parallel lines of the printed board are in close proximity, a delay in the signal waveform is formed, and reflected noise is formed at the end of the transmission line. Therefore, when designing a printed circuit board, care should be taken to use the correct method.
1. Shape 2. Orig 3. Matrix
PCB shape and size are determined by the placement machine's PCB transmission method and mounting area.
Describes how it works when using only copper PCBs from a printed circuit board as a heat sink. First understand the circuit requirements.
Total 7 things.
Layer setting and power ground segmentation requirements; Power module requirements
In this article,I will tell you a new way to solve the problem of high speed singal pcb design
PCB design techniques have an impact on the following three effects:
The PCB manufacturing process begins with a "substrate" made of Glass Epoxy or similar material.
As automated test equipment becomes part of the overall electronics assembly process, DFT must include not only traditional hardware usage issues, but also knowledge of test equipment diagnostic capabilities.
1. EMC, EMI. 2. Routing skills for high-speed differential signals
Signal Integrity is a state in which the signal is not damaged. It shows that the signal maintains its correct functional characteristics after transmission through the signal line. The signal can respond with correct timing and voltage in the circuit. It can be known from the timing of the IC if the signal is in steady state time (in order to correctly identify and process the data, The IC requires a large transition within the time period during which the input data remains unchanged before and after the clock edge, and the IC may misjudge or lose part of the data. If the signal has good signal integrity, the circuit has the correct timing relationship and signal amplitude, and the data will not be captured by mistake, which means that the receiver can obtain relatively pure data. Conversely, if a signal integrity fault such as false triggering, damped oscillation, overshoot, undershoot occurs, any signal transition will occur, causing the input distortion data to be sent into the latch or captured on the distorted clock edge. Data, the signal can not respond properly, resulting in abnormal system operation and performance degradation.
In design, layout is an important part. The quality of the layout results will directly affect the effect of the wiring, so it can be considered that a reasonable layout is the first step in the success of PCB design.
This article focuses on signal integrity challenges involving high-speed interface design (the main features of RapidIO switching support these high-speed interface designs), and the ability to optimize RapidIO switching is designed to achieve high signal integrity in high-speed designs.
1. Printed circuit board size and device layout. 2. Decoupling capacitor configuration. 3. The heat dissipation design. 4. Electromagnetic compatibility design. 5. Ground wire design.
Conducting printed circuit board (PCB) design refers to the production of circuit boards at the lowest possible cost by designing schematic drawings and wiring layout. In the past, this usually required expensive tools, but now, with the availability of free high-performance software tools such as DesignSpark PCBs and design models, the speed of board designers has been greatly accelerated.
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