PCB Assembly Technical Capabilities: SMT / BGA / THT Specifications

Our SMT lines handle passive components down to 01005 imperial (0402 metric) — among the smallest chip sizes in standard production. For ICs, we support fine-pitch leads as narrow as 0.38mm pitch. For BGA and LGA packages, we achieve placement accuracy at 0.25mm ball pitch, with mandatory X-ray inspection on every BGA and QFN board to verify solder joint integrity beneath the package. There is no minimum order quantity — these capabilities apply from a single prototype board.

We support the full range of assembly technologies under one roof: Surface Mount Assembly (SMT) via automated reflow soldering, Through-Hole Assembly (THT) via wave soldering or selective soldering, and Mixed Technology (SMT + THT) on the same board. Both single-sided and double-sided assembly are supported. For boards requiring both automated and manual soldering processes, our IPC-certified technicians handle the hand-soldering steps inline with production, maintaining IPC-A-610 Class 2 workmanship throughout.

Our assembly lines are configured for Rigid FR4 PCBs (standard and high-Tg), Flexible PCBs, Rigid-Flex PCBs, and Metal-Core PCBs including aluminum and copper-core substrates commonly used in LED and power electronics applications. Each substrate type follows a dedicated handling and reflow profile to prevent delamination or warpage. If your design uses a custom or specialty substrate, contact our engineering team before ordering for a pre-assembly DFA review at no charge.

X-ray inspection is mandatory for all boards containing BGA, QFN, LGA, or flip-chip packages. We use automated X-ray (AXI) to detect cold solder joints, voids, bridging, and missing balls — defects that are invisible to optical inspection. In addition, every assembled board passes through automated optical inspection (AOI) to check component placement, polarity, and solder fillet quality on all visible joints. For critical applications, solder paste volume is verified by Solder Paste Inspection (SPI) before reflow. All workmanship is evaluated against IPC-A-610 Class 2 as standard, with Class 3 available on request for aerospace, medical, and high-reliability end uses.

Beyond visual and X-ray inspection, we offer a full post-assembly electrical and functional test suite. In-Circuit Testing (ICT) is available via flying probe (no fixture required, ideal for prototypes) or bed-of-nails fixture (high volume). Functional Circuit Testing (FCT) validates the board under simulated operating conditions against your custom test plan. For high-reliability applications, we also support aging tests, temperature and humidity cycling, and drop testing. IC programming and firmware flashing can be performed inline during production. All test results are documented in certified reports delivered with your order.

There is no minimum order quantity — we assemble from a single board through to volume runs of 10,000+ units using the same production lines and quality standards. For lead time, our express option delivers assembled boards in as little as 24 hours once all components are confirmed ready. Standard production completes within 5–7 working days when components are sourced through our HQ Online inventory, which holds over 600,000 parts in local stock. Lead times for full-turnkey orders where components must be procured externally depend on part availability and are confirmed at the quotation stage.

We support three flexible consignment models. Full Turnkey: NextPCB sources all components on your BOM via HQ Online and our global distributor network (Digi-Key, Mouser, Element14, and others), handling procurement, kitting, and assembly end-to-end. Partial Turnkey: You supply select components — proprietary parts, pre-approved substitutes, or customer-furnished items — while we source the remainder. Full Consignment (Kitted): You supply all components pre-kitted to BOM; we handle PCB fabrication and assembly only. SMT components are accepted in cut tape, partial reel, full reel, tube, or tray packaging. Please include at least 5–10% attrition overage for SMT passives to account for placement losses.